Light emitting diode package and fabrication method thereof

A light emitting diode package comprising:

• first and second lead frames spaced apart from each other and formed of a heat and electric conductor;
• a package body fixing the first and second lead frames while exposing an underside surface of at least one of the first and second lead frames;
• a light emitting diode chip disposed on an upper surface of the first lead frame or the second lead frame;
• and
• a transparent encapsulant for encapsulating the light emitting diode chip,
• wherein each of the first and second lead frames comprises a planar base and a pair of extensions,
• wherein the extensions of the first lead frame extend in opposite directions and an upward direction from opposed ends of the planar base of the first lead frame, and the extensions of the second lead frame extend in opposite directions and an upward direction from opposed ends of the planar base of the second lead frame, and
• wherein the planar base and extensions of the first lead frame extend, in a lengthwise direction of the first lead frame, substantially in parallel with those of the second lead frame.