H05K 9/0039
Galvanic coupling of ground layer on printed circuit board [pcb] to conductive
Official title: {Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing (printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218)}
H05K9/0039 (Galvanic coupling of ground layer on printed circuit board [pcb] to conductive) appears on 527 US grants and 289 published applications in this corpus.
Search patents in H05K- Granted patents
- 527
- Published applications
- 289
- Assignees
- 296
- Inventors
- 1,114
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 10 | 0 |
| 1990 | 10 | 0 |
| 1991 | 16 | 0 |
| 1992 | 9 | 0 |
| 1993 | 15 | 0 |
| 1994 | 22 | 0 |
| 1995 | 17 | 0 |
| 1996 | 27 | 0 |
| 1997 | 18 | 0 |
| 1998 | 14 | 0 |
| 1999 | 30 | 0 |
| 2000 | 26 | 0 |
| 2001 | 33 | 7 |
| 2002 | 13 | 23 |
| 2003 | 24 | 17 |
| 2004 | 12 | 14 |
| 2005 | 16 | 19 |
| 2006 | 14 | 13 |
| 2007 | 14 | 9 |
| 2008 | 5 | 14 |
| 2009 | 7 | 5 |
| 2010 | 4 | 3 |
| 2011 | 4 | 6 |
| 2012 | 11 | 10 |
| 2013 | 6 | 8 |
| 2014 | 8 | 7 |
| 2015 | 4 | 9 |
| 2016 | 5 | 8 |
| 2017 | 9 | 10 |
| 2018 | 8 | 10 |
| 2019 | 13 | 12 |
| 2020 | 9 | 15 |
| 2021 | 14 | 17 |
| 2022 | 13 | 8 |
| 2023 | 11 | 19 |
| 2024 | 10 | 13 |
| 2025 | 13 | 8 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Module including metal member with protruding portion and method for manufacturing module29 Sep 2026US 12,750,992 B2Murata Manufacturing Co., Ltd.
- PCB, PCB mounting box, case assembly, and case22 Sep 2026US 12,745,344 B2Zte Corporation
- Thermally insulating and electrically conductive spacer30 Jun 2026US 12,672,249 B2Google Inc.
- Electronics module immersion sealing with electromagnetic compatibility mitigation9 Jun 2026US 12,652,749 B2Harman International Industries, Incorporated
- Connection assembly and control device5 May 2026US 12,620,761 B2AUMOVIO Autonomous Mobility Germany GmbH
- Vehicle control device6 Aug 2026US 2026/0231382 A1Astemo, Ltd.
- Electronic modules and associated systems16 Jul 2026US 2026/0206157 A1
- Photovoltaic optimizer25 Jun 2026US 2026/0182081 A1Huawei Digital Power Technologies Co., Ltd.
- Display device and electronic device21 May 2026US 2026/0143602 A1Samsung Electronics Co., Ltd.
- Hybrid cooling system and electromagnetic interference shield1 Jan 2026US 2026/0006713 A1Intel Corporation
Most cited
By later US patents
- Shielded electronic component assembly and method for making the same392US 5,639,989 AMotorola, Inc. · 1997
- Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures237US 6,282,095 B1Compaq Computer Corporation · 2001
- Faraday cage for a printed circuit card177US 5,592,391 AInternational Business Machines Corporation · 1997
- Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel150US 5,784,259 ASeiko Epson Corporation · 1998
- Stackable RF filter for a receiver or transmitter141US 11,616,279 B2ThinkRF Corporation · 2023