Electronics module immersion sealing with electromagnetic compatibility mitigation
AssigneeHarman International Industries, Incorporated
InventorsAlexander Tzinares, Jose Rodrigo Molotla
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AssigneeHarman International Industries, Incorporated
InventorsAlexander Tzinares, Jose Rodrigo Molotla
Estimating the term…
In at least one embodiment, an electronic module includes a first housing, a second housing, a printed circuit board (PCB), a ground contact, and a sealant. The first housing includes a first receiving portion. The second housing includes a second receiving portion, the second housing being coupled to the first housing defining a cavity positioned between the first receiving portion and the second receiving portion. The printed circuit board (PCB) is positioned between the first housing and the second housing therein to receive a plurality of electronics. The ground contact is positioned on the PCB and within the cavity contacting the first receiving portion and the second receiving portion. The ground contact mitigates electromagnetic interference (EMI) generated from the plurality of electronics. The sealant is positioned within the cavity and adjacent to the ground contact to prevent debris or liquid from contacting the plurality of electronics.
An electronic module comprising:
An electronic module comprising:
An electronic module comprising:
Dependencies are inferred from the claim text.