H05K 9/0009

With provisions to reduce emi leakage through the joining parts

Official title: {with provisions to reduce EMI leakage through the joining parts}

H05K9/0009 (With provisions to reduce emi leakage through the joining parts) appears on 145 US grants and 154 published applications in this corpus.

Search patents in H05K
Granted patents
145
Published applications
154
Assignees
114
Inventors
337
Latest grant
25 Aug 2026

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H05K 9/0009: granted patents and published applications per publication year
YearGranted patentsPublished applications
199210
199300
199400
199500
199600
199700
199800
199900
200000
200110
200200
200300
200400
200501
200610
200700
200801
200912
201015
201158
201216
2013912
201454
2015910
2016127
201776
20181214
2019119
20201313
20211212
20221015
20231213
2024113
202576
202647

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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