H05K 7/1444
Complex or three-dimensional-arrangements
Official title: {Complex or three-dimensional-arrangements; Stepped or dual mother boards}
H05K7/1444 (Complex or three-dimensional-arrangements) appears on 131 US grants and 129 published applications in this corpus.
Search patents in H05K- Granted patents
- 131
- Published applications
- 129
- Assignees
- 64
- Inventors
- 206
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 9 |
| 2003 | 2 | 0 |
| 2004 | 7 | 5 |
| 2005 | 1 | 1 |
| 2006 | 3 | 2 |
| 2007 | 1 | 0 |
| 2008 | 0 | 17 |
| 2009 | 1 | 5 |
| 2010 | 4 | 1 |
| 2011 | 5 | 10 |
| 2012 | 10 | 9 |
| 2013 | 11 | 12 |
| 2014 | 5 | 4 |
| 2015 | 4 | 4 |
| 2016 | 6 | 2 |
| 2017 | 6 | 7 |
| 2018 | 5 | 2 |
| 2019 | 9 | 9 |
| 2020 | 4 | 7 |
| 2021 | 9 | 4 |
| 2022 | 1 | 4 |
| 2023 | 4 | 6 |
| 2024 | 9 | 3 |
| 2025 | 1 | 3 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Board-level architecture and communications device12 May 2026US 12,627,087 B2Huawei Technologies Co., Ltd.
- Reference electrical potential assembly and attachment assembly for printed circuit18 Mar 2025US 12,256,513 B2Latelec
- Connectors for a networking device with orthogonal switch bars3 Sep 2024US 12,082,365 B2Cisco Technology, Inc.
- System device aggregation in a liquid cooling environment3 Sep 2024US 12,082,370 B2Intel Corporation
- Mainboard connection structure and guiding device30 Jul 2024US 12,052,823 B2Fulian Precision Electronics (Tianjin) Co., LTD.
- Circuit board coupling structure11 Jun 2026US 2026/0164584 A1Hirose Electric Co., Ltd.
- Electronic device14 May 2026US 2026/0135310 A1Huawei Technologies Co., Ltd.
- Modular system backplane and method19 Feb 2026US 2026/0051691 A1Rockwell Collins, Inc.
- Backplane system, fabrication method therefor, and cabinet23 Oct 2025US 2025/0331117 A1xFusion Digital Technologies Co., Ltd
- Multi-node server15 May 2025US 2025/0159835 A1Pegatron Corporation
Most cited
By later US patents
- Integrated backplane interconnection architecture98US 5,122,691 A1992
- Information-processing device having a crossbar-board connected to back panels on different sides83US 6,690,584 B2Fujitsu Limited · 2004
- Apparatus, system, and method for a shared, front-end, distributed RAID82US 7,934,055 B2Fusion-Io, Inc. · 2011
- Apparatus, system, and method for solid-state storage as cache for high-capacity, non-volatile storage81US 8,019,938 B2Fusion-I0, Inc. · 2011
- Circuit board riser59US 6,749,439 B1Network Engineers, Inc. · 2004