H05K 7/1439
Back panel mother boards
Official title: {Back panel mother boards}
H05K7/1439 (Back panel mother boards) appears on 524 US grants and 446 published applications in this corpus.
Search patents in H05K- Granted patents
- 524
- Published applications
- 446
- Assignees
- 250
- Inventors
- 1,050
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 13 | 0 |
| 1992 | 12 | 0 |
| 1993 | 6 | 0 |
| 1994 | 13 | 0 |
| 1995 | 2 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 9 | 0 |
| 2000 | 14 | 0 |
| 2001 | 6 | 1 |
| 2002 | 19 | 23 |
| 2003 | 12 | 10 |
| 2004 | 14 | 18 |
| 2005 | 9 | 8 |
| 2006 | 18 | 14 |
| 2007 | 14 | 15 |
| 2008 | 6 | 26 |
| 2009 | 8 | 13 |
| 2010 | 14 | 9 |
| 2011 | 13 | 24 |
| 2012 | 22 | 14 |
| 2013 | 21 | 22 |
| 2014 | 16 | 18 |
| 2015 | 10 | 14 |
| 2016 | 18 | 16 |
| 2017 | 22 | 22 |
| 2018 | 30 | 71 |
| 2019 | 37 | 27 |
| 2020 | 28 | 15 |
| 2021 | 21 | 18 |
| 2022 | 13 | 13 |
| 2023 | 15 | 12 |
| 2024 | 14 | 9 |
| 2025 | 6 | 6 |
| 2026 | 4 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Computing system with connecting boards16 Jun 2026US 12,660,086 B2Samsung Electronics Co., Ltd.
- Adaptive chassis design accommodating multi form factor pluggable modules in network applications19 May 2026US 12,635,100 B2Ciena Corporation
- Board-level architecture and communications device12 May 2026US 12,627,087 B2Huawei Technologies Co., Ltd.
- Cable modules with pogo pins for identification of cable module mounting location on cabled backplane panel13 Jan 2026US 12,526,948 B2Hewlett Packard Enterprise Development LP
- Data storage system with parallel array of dense memory cards and high airflow20 May 2025US 12,306,681 B2SK Hynix NAND Product Solutions Corp.
- Method for mechanical packaging for modular energy system17 Sep 2026US 2026/0282262 A1Cilag GmbH International
- Split backplane connection design with high speed interconnect18 Jun 2026US 2026/0173296 A1BAE Systems Information and Electronic Systems Integration Inc.
- Circuit board coupling structure11 Jun 2026US 2026/0164584 A1Hirose Electric Co., Ltd.
- Electronic device14 May 2026US 2026/0135310 A1Huawei Technologies Co., Ltd.
- Processor integrated module, server, and assembly method for processor integrated module30 Apr 2026US 2026/0122824 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
Most cited
By later US patents
- Midplane especially applicable to an orthogonal architecture electronic system215US 7,108,556 B2Amphenol Corporation · 2006
- Differential electrical connector assembly206US 7,094,102 B2Amphenol Corporation · 2006
- Readily expandable input/output construction for programmable controller125US 4,558,914 AGould Inc. · 1985
- Switching midplane and interconnecting system for interconnecting large numbers of signals124US 5,887,158 AQuickturn Design Systems, Inc. · 1999
- Switching midplane and interconnection system for interconnecting large numbers of signals117US 5,352,123 AQuickturn Systems, Incorporated · 1994