H05K 7/1441
With a segmented structure
Official title: {with a segmented structure}
H05K7/1441 (With a segmented structure) appears on 65 US grants and 41 published applications in this corpus.
Search patents in H05K- Granted patents
- 65
- Published applications
- 41
- Assignees
- 51
- Inventors
- 159
- Latest grant
- 11 Feb 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 9 |
| 2003 | 3 | 0 |
| 2004 | 3 | 2 |
| 2005 | 1 | 2 |
| 2006 | 3 | 4 |
| 2007 | 2 | 4 |
| 2008 | 2 | 2 |
| 2009 | 2 | 0 |
| 2010 | 3 | 1 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 2 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 3 |
| 2017 | 3 | 1 |
| 2018 | 2 | 1 |
| 2019 | 0 | 0 |
| 2020 | 2 | 2 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board assembly, backplane interconnection system, and electronic device11 Feb 2025US 12,224,512 B2Huawei Technologies Co., Ltd.
- Cable connection structure, single-board assembly, single-board assembly connection structure18 Jun 2024US 12,016,146 B2Xi'an Zhongxing New Software Co., Ltd.
- Storage device19 Apr 2022US 11,310,933 B2Hitachi, Ltd.
- Breadboard and electronics experimentation system9 Feb 2021US 10,915,687 B2Joebotics Incorporated
- Modular bridge array for bridging electronic components9 Jun 2020US 10,680,382 B2Quanta Computer Inc.
- Split backplane connection design with high speed interconnect18 Jun 2026US 2026/0173296 A1BAE Systems Information and Electronic Systems Integration Inc.
- Spring-biased movable connector assembly for storage-device bays26 Feb 2026US 2026/0059689 A1Aivres Systems Inc.
- Sled, orthogonal-direct chassis, and methods5 Jun 2025US 2025/0185201 A1ExpectedIT GmbH
- Cable connection structure, single-board assembly, single-board assembly connection structure1 Dec 2022US 2022/0386494 A1Zte Corporation
- Circuit board assembly, backplane interconnection system, and electronic device9 Jun 2022US 2022/0181810 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Readily expandable input/output construction for programmable controller125US 4,558,914 AGould Inc. · 1985
- Segmented backplane for multiple microprocessing modules108US 5,006,961 ACatene Systems Corporation · 1991
- High frequency electronic assembly80US 5,083,238 AMotorola, Inc. · 1992
- Modular backplane80US 5,325,270 ATelco Systems, Inc. · 1994
- Electrical assembly with modular carriers for signal processing modules79US 4,738,632 ASiemens Aktiengesellschaft · 1988