Circuit board assembly, backplane interconnection system, and electronic device

A backplane interconnection system, comprising:

• a circuit board assembly;
• and
• a front sub-circuit board, wherein the circuit board assembly comprises a bracket and a circuit board, wherein the circuit board is formed with a fastened part and a free part, the fastened part is connected to the bracket, the free part is suspended, a surface on which the free part and the fastened part are co-located is a first plane, the free part has an amplitude of swing in a first direction, the first direction is perpendicular to the first plane, the circuit board is configured to plug-connect to the front sub-circuit board, a first connector is plug-connected to a first plug-connection end on the front sub-circuit board and is disposed on the free part, and the amplitude of swing of the free part is capable of enabling the first connector to plug-connect to the first plug-connection end,
• wherein the circuit board comprises a first circuit board and a second circuit board that are stacked, the first circuit board and the second circuit board each is disposed with at least one first connector, the front sub-circuit board comprises a first front sub-circuit board, both the first circuit board and the second circuit board are connected to the first front sub-circuit board, the first plug-connection end is disposed at a location that is on the first front sub-circuit board and that is opposite to the at least one first connector of the first circuit board, and the first plug-connection end is disposed at a location that is on the first front sub-circuit board and that is opposite to the at least one first connector of the second circuit board,
• the backplane interconnection system further comprises a rear sub-circuit board, wherein the rear sub-circuit board comprises a first rear sub-circuit board and a second rear sub-circuit board that are stacked, a direction in which the first rear sub-circuit board and the second rear sub-circuit board are stacked is parallel to the direction in which the first circuit board and the second circuit board are stacked, the first rear sub-circuit board is connected to the first circuit board, the second rear sub-circuit board is connected to the second circuit board, and second connectors correspondingly connected to the first rear sub-circuit board and the second rear sub-circuit board are disposed on the fastened part of the first circuit board and the fastened part of the second circuit board.

An electronic device, comprising:

• a chassis;
• and
• a backplane interconnection system, wherein the backplane interconnection system is disposed in the chassis, and the backplane interconnection system comprises:
• a circuit board assembly;
• and
• a front sub-circuit board, wherein the circuit board assembly comprises a bracket and a circuit board, wherein the circuit board is formed with a fastened part and a free part, the fastened part is connected to the bracket, the free part is suspended, a surface on which the free part and the fastened part are co-located is a first plane, the free part has an amplitude of swing in a first direction, the first direction is perpendicular to the first plane, the circuit board is configured to plug-connect to the front sub-circuit board, a first connector is plug-connected to a first plug-connection end on the front sub-circuit board and is disposed on the free part, and the amplitude of swing of the free part is capable of enabling the first connector to plug-connect to the first plug-connection end,
• wherein the circuit board comprises a first circuit board and a second circuit board that are stacked, the first circuit board and the second circuit board each is disposed with at least one first connector, the front sub-circuit board comprises a first front sub-circuit board, both the first circuit board and the second circuit board are connected to the first front sub-circuit board, the first plug-connection end is disposed at a location that is on the first front sub-circuit board and that is opposite to the at least one first connector of the first circuit board, and the first plug-connection end is disposed at a location that is on the first front sub-circuit board and that is opposite to the at least one first connector of the second circuit board,
• the backplane interconnection system further comprises a rear sub-circuit board, wherein the rear sub-circuit board comprises a first rear sub-circuit board and a second rear sub-circuit board that are stacked, a direction in which the first rear sub-circuit board and the second rear sub-circuit board are stacked is parallel to the direction in which the first circuit board and the second circuit board are stacked, the first rear sub-circuit board is connected to the first circuit board, the second rear sub-circuit board is connected to the second circuit board, and second connectors correspondingly connected to the first rear sub-circuit board and the second rear sub-circuit board are disposed on the fastened part of the first circuit board and the fastened part of the second circuit board.