System device aggregation in a liquid cooling environment

A method comprising:

• providing a container including a fluid;
• and
• placing a first device in the container, the first device coupled to a first circuit board,
• the first circuit board coupled to a second circuit board, a memory device coupled to a third circuit board,
• the second circuit board including a first edge,
• the third circuit board including a first edge, a second edge, a third edge, and a fourth edge, the second edge opposite the first edge, the fourth edge opposite the third edge,
• the third circuit board including a first side and a second side, the first side extending between the third edge and the fourth edge, the second side opposite the first side, and
• the third circuit board including a recess extending from the first edge of the third circuit board and defined in the first side and the second side of the third circuit board;
• when the second circuit board is coupled to the third circuit board via the recess, a portion of the second circuit board extends between the first edge of the second circuit board and the first edge of the third circuit board, and the first edge of the second circuit board is further than the first edge of the third circuit board from the second edge of the third circuit board;
• the second circuit board conductively coupled to the third circuit board using a flexible connector, and
• the second circuit board and third second circuit board are within the container.

A method comprising:

• placing a compute column apparatus into a container that covers the compute column apparatus, the compute column apparatus including:
• a first circuit board, a first side of the first circuit board conductively coupled to at least one device;
• a second circuit board, a first side of the second circuit board conductively coupled to a second side of the first circuit board, the second circuit board including a first edge;
• a third circuit board including a first edge, a second edge, a third edge, and a fourth edge, the second edge opposite the first edge, the fourth edge opposite the third edge,
• the third circuit board including a first side and a second side, the first side extending between the third edge and the fourth edge, the second side opposite the first side, and
• the third circuit board including a recess extending from the first edge of the third circuit board and defined in the first side and the second side of the third circuit board;
• when the second circuit board is coupled to the third circuit board via the recess, a portion of the second circuit board extends between the first edge of the second circuit board and the first edge of the third circuit board, and the first edge of the second circuit board is further than the first edge of the third circuit board from the second edge of the third circuit board;
• and
• flexible connectors to conductively connect the second circuit board with the third circuit board;
• and
• providing fluid in the container to provide immersion liquid cooling to the compute column apparatus.