H05K 7/1434
For electronics exposed to high gravitational force
Official title: {for electronics exposed to high gravitational force; Cylindrical housings}
H05K7/1434 (For electronics exposed to high gravitational force) appears on 87 US grants and 70 published applications in this corpus.
Search patents in H05K- Granted patents
- 87
- Published applications
- 70
- Assignees
- 67
- Inventors
- 195
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 0 |
| 2003 | 0 | 2 |
| 2004 | 5 | 1 |
| 2005 | 1 | 2 |
| 2006 | 1 | 4 |
| 2007 | 4 | 1 |
| 2008 | 0 | 3 |
| 2009 | 1 | 2 |
| 2010 | 1 | 4 |
| 2011 | 0 | 1 |
| 2012 | 1 | 3 |
| 2013 | 2 | 1 |
| 2014 | 2 | 1 |
| 2015 | 2 | 2 |
| 2016 | 2 | 7 |
| 2017 | 5 | 6 |
| 2018 | 3 | 3 |
| 2019 | 3 | 6 |
| 2020 | 4 | 3 |
| 2021 | 1 | 3 |
| 2022 | 5 | 4 |
| 2023 | 4 | 6 |
| 2024 | 6 | 3 |
| 2025 | 2 | 2 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronics packaging for moving platforms8 Sep 2026US 12,733,099 B2Raytheon Company
- Electronic device with force feedback and interlocking system for coupling two electronic boards24 Mar 2026US 12,586,939 B2Edge Technologies, Inc.
- Circuit card assemblies10 Jun 2025US 12,328,847 B2Ametek, Inc.
- Electronics unit1 Apr 2025US 12,267,974 B2Mbda UK Limited
- Electric device12 Nov 2024US 12,144,152 B2NEC Corporation
- Passive cooling system for radiofrequency components27 Nov 2025US 2025/0365894 A1Rockwell Collins, Inc.
- Electronic connectors for use on board a spacecraft19 Jun 2025US 2025/0202144 A1Airbus Defence and Space GmbH
- Passive, porous, phase-change cold plate10 Oct 2024US 2024/0341063 A1Raytheon Company
- Electronic device with force feedback and interlocking system for coupling two electronic boards18 Jul 2024US 2024/0243502 A1Edge Technologies, Inc.
- Electronics unit13 Jun 2024US 2024/0196556 A1Mbda UK Limited
Most cited
By later US patents
- Electronic magnetic interference and radio frequency interference protection of airborne missile electronics using conductive plastics126US 6,271,464 B1Raytheon Company · 2001
- Hot melt ink supply system68US 4,814,786 ASpectra, Inc. · 1989
- Repeater housing and circuit mounting structure65US 4,528,615 AAT&T Bell Laboratories · 1985
- Microelectronic package with tubular housing55US 6,778,389 B1Visteon Global Technologies, Inc. · 2004
- Electronic circuit housing40US 4,858,068 AAlcatel Cit · 1989