H05K 7/026
Multiple connections subassemblies
Official title: {Multiple connections subassemblies}
H05K7/026 (Multiple connections subassemblies) appears on 446 US grants and 520 published applications in this corpus.
Search patents in H05K- Granted patents
- 446
- Published applications
- 520
- Assignees
- 208
- Inventors
- 907
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 9 | 0 |
| 1991 | 10 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 7 |
| 2002 | 11 | 17 |
| 2003 | 15 | 20 |
| 2004 | 12 | 16 |
| 2005 | 12 | 12 |
| 2006 | 13 | 12 |
| 2007 | 13 | 12 |
| 2008 | 15 | 21 |
| 2009 | 15 | 18 |
| 2010 | 13 | 14 |
| 2011 | 6 | 8 |
| 2012 | 11 | 13 |
| 2013 | 13 | 24 |
| 2014 | 9 | 22 |
| 2015 | 20 | 27 |
| 2016 | 31 | 39 |
| 2017 | 33 | 20 |
| 2018 | 30 | 20 |
| 2019 | 26 | 17 |
| 2020 | 23 | 25 |
| 2021 | 18 | 10 |
| 2022 | 4 | 10 |
| 2023 | 8 | 13 |
| 2024 | 10 | 9 |
| 2025 | 10 | 11 |
| 2026 | 3 | 103 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Modular power system24 Mar 2026US 12,588,157 B2
- Heat dissipation bolt17 Mar 2026US 12,580,374 B2Suzhou Littlefuse OVS Co., Ltd.
- Method of using an organizer for manufacture of electronic device with cabled interconnects6 Jan 2026US 12,519,277 B2Amphenol Corporation
- Circuit assembly and electrical junction box16 Dec 2025US 12,500,402 B2Sumitomo Wiring Systems, Ltd.
- Resin structure11 Nov 2025US 12,471,224 B2Yazaki Corporation
- Vertical power supply system24 Sep 2026US 2026/0293020 A1Delta Electronics, Inc.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
- Busbar and electrical connection unit6 Aug 2026US 2026/0229863 A1Yazaki Corporation
- Targeted Jet-Cooling System for Zetta-Scale Computing Assemblies16 Jul 2026US 2026/0202891 A1
Most cited
By later US patents
- Electrical module254US 9,907,196 B2Sagemcom Broadband SAS · 2018
- Indicia-reading module with an integrated flexible circuit144US 9,277,668 B2Hand Held Products, Inc. · 2016
- Electrical power distribution center107US 5,023,752 AGeneral Motors Corporation · 1991
- Electrical wiring device with high current USB charging capabilities99US 8,758,031 B2Pass & Seymour, Inc. · 2014
- Junction block with integral printed circuit board and electrical connector for same80US 5,764,487 AYazaki Corporation · 1998