H05K 5/062
Sealed by a material injected between a non-removable cover and a body
Official title: {sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ}
H05K5/062 (Sealed by a material injected between a non-removable cover and a body) appears on 148 US grants and 178 published applications in this corpus.
Search patents in H05K- Granted patents
- 148
- Published applications
- 178
- Assignees
- 121
- Inventors
- 404
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 1 |
| 2003 | 1 | 4 |
| 2004 | 2 | 5 |
| 2005 | 1 | 0 |
| 2006 | 4 | 2 |
| 2007 | 1 | 5 |
| 2008 | 0 | 6 |
| 2009 | 6 | 5 |
| 2010 | 5 | 6 |
| 2011 | 3 | 2 |
| 2012 | 3 | 2 |
| 2013 | 3 | 12 |
| 2014 | 3 | 12 |
| 2015 | 10 | 13 |
| 2016 | 13 | 12 |
| 2017 | 11 | 12 |
| 2018 | 11 | 10 |
| 2019 | 12 | 8 |
| 2020 | 9 | 7 |
| 2021 | 8 | 8 |
| 2022 | 6 | 11 |
| 2023 | 6 | 12 |
| 2024 | 6 | 10 |
| 2025 | 9 | 5 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device and manufacturing method of the same23 Jun 2026US 12,666,555 B2E Ink Holdings Inc.
- Electronics module immersion sealing with electromagnetic compatibility mitigation9 Jun 2026US 12,652,749 B2Harman International Industries, Incorporated
- Electronic device including display19 May 2026US 12,635,097 B2Samsung Electronics Co., Ltd.
- Electrical apparatus and plug24 Mar 2026US 12,586,995 B2Yamaha Hatsudoki Kabushiki Kaisha
- Sealed ECU assembly10 Mar 2026US 12,575,039 B2Veoneer US Safety Systems, LLC
- Electronic device including display17 Sep 2026US 2026/0282259 A1Samsung Electronics Co., Ltd.
- Mechanical Part Sealing Method and Electronic Device20 Aug 2026US 2026/0247555 A1Huawei Technologies Co., Ltd.
- Electronic device30 Jul 2026US 2026/0223309 A1TDK Corporation
- Electrical feedthrough assembly11 Jun 2026US 2026/0164583 A1Schott AG
- Process for manufacturing wearable ring form factor7 May 2026US 2026/0123883 A1Oura Health Oy
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Casing for electronic control devices58US 6,407,925 B1Denso Corporation · 2002
- Water-resistant casing structure for electronic control device43US 7,144,275 B2Denso Corporation · 2006
- Electrical device such as a network protector relay with printed circuit board seal41US 5,844,781 AEaton Corporation · 1998
- Casing for electronic control devices38US 6,707,678 B2Denso Corporation · 2004