H05K 5/0065

Wherein modules are associated together

Official title: {wherein modules are associated together, e.g. electromechanical assemblies, modular structures}

H05K5/0065 (Wherein modules are associated together) appears on 161 US grants and 174 published applications in this corpus.

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Granted patents
161
Published applications
174
Assignees
118
Inventors
413
Latest grant
18 Aug 2026

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H05K 5/0065: granted patents and published applications per publication year
YearGranted patentsPublished applications
199110
199210
199310
199400
199510
199600
199710
199820
199910
200000
200110
200200
200315
200411
200500
200613
200710
200810
200900
201002
201103
201221
201313
201401
2015412
2016911
20171010
2018109
2019119
20201435
202196
2022128
20231824
20241715
2025159
2026157

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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