H05K 3/106
By photographic methods
Official title: {by photographic methods}
H05K3/106 (By photographic methods) appears on 59 US grants and 76 published applications in this corpus.
Search patents in H05K- Granted patents
- 59
- Published applications
- 76
- Assignees
- 44
- Inventors
- 171
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 2 | 4 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 1 | 3 |
| 2008 | 2 | 5 |
| 2009 | 2 | 14 |
| 2010 | 4 | 5 |
| 2011 | 6 | 0 |
| 2012 | 3 | 1 |
| 2013 | 2 | 4 |
| 2014 | 1 | 9 |
| 2015 | 4 | 5 |
| 2016 | 3 | 5 |
| 2017 | 4 | 1 |
| 2018 | 4 | 2 |
| 2019 | 0 | 4 |
| 2020 | 0 | 1 |
| 2021 | 4 | 1 |
| 2022 | 1 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 1 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing printed wiring board30 Dec 2025US 12,513,828 B2Ibiden Co., Ltd.
- Method for manufacturing printed wiring board12 Mar 2024US 11,930,601 B2Ibiden Co., Ltd.
- Direct metal printing with stereolithography28 Nov 2023US 11,826,946 B2Arizona Board of Regents on behalf of Arizona State University
- Method for forming redistribution layer using photo-sintering18 Jan 2022US 11,229,124 B2Research & Business Foundation Sungkyunkwan University
- Direct metal printing with stereolithography5 Oct 2021US 11,135,649 B2Arizona Board of Regents on behalf of Arizona State University
- A Manufacturing Method of Near-Field Wireless Communication Antennas by Using Textile Materials13 Aug 2026US 2026/0239540 A1Digital Clothing Limited
- Method for manufacturing printed wiring board and laminating system used for implementing the method23 Oct 2025US 2025/0331109 A1Ibiden Co., Ltd.
- Real-time in-situ additive circuit tuning for rf/microwave electronics20 Feb 2025US 2025/0063672 A1Raytheon Company
- Method for manufacturing printed wiring board and laminating system used for implementing the method6 Jun 2024US 2024/0188228 A1Ibiden Co., Ltd.
- Direct metal printing with stereolithography21 Dec 2023US 2023/0405918 A1Arizona Board of Regents on behalf of Arizona State University
Most cited
By later US patents
- Process for preparing conductive material33US 8,012,676 B2Mitsubishi Paper Mills Limited · 2011
- Laser activatable polymer composition31US 9,896,566 B2Ticona LLC · 2018
- Process for making indicia bearing anodized article30US 3,953,625 AHorizons Incorporated · 1976
- Conductive film and method of producing thereof27US 7,985,527 B2FUJIFILM Corporation · 2011
- Process for the partial metallization of substrate surfaces26US 4,753,821 ABayer Aktiengesellschaft · 1988