H05K 2203/167
Using mechanical means for positioning, alignment or registration
Official title: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
H05K2203/167 (Using mechanical means for positioning, alignment or registration) appears on 799 US grants and 710 published applications in this corpus.
Search patents in H05K- Granted patents
- 799
- Published applications
- 710
- Assignees
- 496
- Inventors
- 1,858
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 13 | 0 |
| 1992 | 7 | 0 |
| 1993 | 12 | 0 |
| 1994 | 13 | 0 |
| 1995 | 17 | 0 |
| 1996 | 23 | 0 |
| 1997 | 22 | 0 |
| 1998 | 14 | 0 |
| 1999 | 22 | 0 |
| 2000 | 15 | 0 |
| 2001 | 19 | 13 |
| 2002 | 19 | 20 |
| 2003 | 29 | 24 |
| 2004 | 24 | 32 |
| 2005 | 14 | 32 |
| 2006 | 25 | 40 |
| 2007 | 25 | 39 |
| 2008 | 25 | 39 |
| 2009 | 25 | 35 |
| 2010 | 24 | 47 |
| 2011 | 29 | 36 |
| 2012 | 19 | 26 |
| 2013 | 31 | 26 |
| 2014 | 25 | 29 |
| 2015 | 25 | 29 |
| 2016 | 31 | 25 |
| 2017 | 20 | 20 |
| 2018 | 22 | 18 |
| 2019 | 15 | 30 |
| 2020 | 30 | 30 |
| 2021 | 29 | 25 |
| 2022 | 19 | 30 |
| 2023 | 24 | 23 |
| 2024 | 14 | 16 |
| 2025 | 22 | 13 |
| 2026 | 7 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device16 Jun 2026US 12,656,644 B2Samsung Display Co., Ltd.
- Receptacle assembly and circuit board9 Jun 2026US 12,652,751 B2Yamaichi Electronics Co., Ltd.
- Current sensing device12 May 2026US 12,625,167 B2ABB Schweiz AG
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Panel-molded electronic assemblies31 Mar 2026US 12,593,411 B1Vicor Corporation
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Notch Design and Rocking Fixture for Board Stacking13 Aug 2026US 2026/0239537 A1Apple Inc.
- Solder area formed to capture two wires6 Aug 2026US 2026/0229801 A1Kollmorgen Corporation
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- System and method for positioning a reflector on printed circuit board18 Jun 2026US 2026/0168651 A1Valeo Vision
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Flexible preformed planar structures for interposing between a chip and a substrate242US 5,489,804 ALSI Logic Corporation · 1996
- Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias220US 5,468,681 ALSI Logic Corporation · 1995
- Integrated circuit package including lead frame with electrically isolated alignment feature184US 6,246,108 B1Micron Technology, Inc. · 2001