H05K 2203/0534
Offset printing, i.e. transfer of a pattern from a carrier onto the
Official title: Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
H05K2203/0534 (Offset printing, i.e. transfer of a pattern from a carrier onto the) appears on 82 US grants and 82 published applications in this corpus.
Search patents in H05K- Granted patents
- 82
- Published applications
- 82
- Assignees
- 55
- Inventors
- 180
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 5 |
| 2003 | 1 | 8 |
| 2004 | 9 | 6 |
| 2005 | 2 | 6 |
| 2006 | 6 | 6 |
| 2007 | 1 | 9 |
| 2008 | 2 | 3 |
| 2009 | 3 | 6 |
| 2010 | 2 | 1 |
| 2011 | 1 | 1 |
| 2012 | 3 | 1 |
| 2013 | 0 | 4 |
| 2014 | 3 | 1 |
| 2015 | 3 | 1 |
| 2016 | 2 | 2 |
| 2017 | 0 | 8 |
| 2018 | 4 | 2 |
| 2019 | 7 | 2 |
| 2020 | 1 | 2 |
| 2021 | 5 | 4 |
| 2022 | 3 | 1 |
| 2023 | 2 | 3 |
| 2024 | 2 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reel-to-reel surface press apparatus23 Jun 2026US 12,662,343 B2Haesung Ds Co., Ltd.
- Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits12 Mar 2024US 11,926,524 B1Iowa State University Research Foundation, Inc.
- Application of electrical conductors of a solar cell16 Jan 2024US 11,877,402 B2Lumet Technologies Ltd.
- Methods for printing solder paste and other viscous materials at high resolution11 Jul 2023US 11,697,166 B2IO Tech Group Ltd.
- Device for manufacturing conductive film10 Jan 2023US 11,553,600 B2Samsung Display Co., Ltd.
- A method and a system for generating a high-resolution pattern on a substrate14 Dec 2023US 2023/0399736 A1Teknologian tutkimuskeskus VTT Oy
- Application of Electrical Conductors of a Solar Cell27 Apr 2023US 2023/0129839 A1Lumet Technologies Ltd.
- Reel-to-reel surface press apparatus30 Mar 2023US 2023/0094795 A1Haesung Ds Co., Ltd.
- Methods for printing solder paste and other viscous materials at high resolution1 Dec 2022US 2022/0379396 A1IO Tech Group Ltd.
- Connection structure16 Sep 2021US 2021/0289623 A1Mikuni Electron Corporation
Most cited
By later US patents
- Electrical circuit component formed of a conductive liquid printed directly onto a substrate117US 5,763,058 AParamount Packaging Corporation · 1998
- Apparatus and method for creating flexible circuits80US 6,697,694 B2Electronic Materials, L.L.C. · 2004
- Electrical circuit component formed of a conductive liquid printed directly onto a substrate60US 6,010,771 ABemis Company, Inc. · 2000
- System and method for high speed processing of turbo codes60US 6,775,800 B2Icoding Technology, Inc. · 2004
- Transfer sheet, and pattern-forming method59US 5,992,320 ADai Nippon Printing Co.Ltd. · 1999