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US 2021/0289623 A1Published application
Connection structure
AssigneeMikuni Electron Corporation
InventorSakae Tanaka
Life of this patent
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Abstract
A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.
Claims10
A connection structure comprising:
- a first member having a first surface;
- at least one first electrode located on the first surface;
- a second member having a second surface opposed to the first surface;
- at least one second electrode opposed to the at least one first electrode and located on the second surface;
- a first resin and at least one conductive particle arranged in at least one first region between the at least one first electrode and the at least one second electrode, the at least one conductive particle including a particle core having elasticity coated with metals;
- and
- a second resin arranged in a second region surrounding the at least one first region between the first surface and the second surface,
- wherein the at least one first electrode overlaps the at least one first region and the second region,
- the second resin is in contact with the at least one first electrode and the at least one second electrode in the second region, and
- the first resin and the second resin have different compositions from each other.
7 more elements
Dependencies are inferred from the claim text.