H05K 2201/2027
Guiding means
Official title: Guiding means, e.g. for guiding flexible circuits
H05K2201/2027 (Guiding means) appears on 128 US grants and 121 published applications in this corpus.
Search patents in H05K- Granted patents
- 128
- Published applications
- 121
- Assignees
- 108
- Inventors
- 313
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 6 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 1 |
| 2002 | 5 | 9 |
| 2003 | 6 | 6 |
| 2004 | 7 | 6 |
| 2005 | 2 | 2 |
| 2006 | 3 | 5 |
| 2007 | 4 | 7 |
| 2008 | 6 | 4 |
| 2009 | 4 | 4 |
| 2010 | 3 | 4 |
| 2011 | 5 | 2 |
| 2012 | 1 | 4 |
| 2013 | 2 | 2 |
| 2014 | 2 | 4 |
| 2015 | 6 | 6 |
| 2016 | 7 | 4 |
| 2017 | 2 | 2 |
| 2018 | 4 | 3 |
| 2019 | 5 | 7 |
| 2020 | 9 | 8 |
| 2021 | 7 | 11 |
| 2022 | 10 | 5 |
| 2023 | 1 | 5 |
| 2024 | 4 | 4 |
| 2025 | 3 | 4 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic circuit assemblies, methods of manufacturing the same, and modules28 Apr 2026US 12,615,719 B2Pragmatic Semiconductor Limited
- Storage module double-layer positioning device set10 Feb 2026US 12,550,266 B2Hanwit Precision Industries Ltd.
- Electronic device including battery21 Oct 2025US 12,453,017 B2Samsung Electronics Co., Ltd.
- Flexible printed circuit assembly wound with reels17 Jun 2025US 12,336,122 B2Honor Device Co., Ltd.
- Connecting assembly comprising flexible printed circuit board and electronic device including the same27 May 2025US 12,317,418 B2Samsung Electronics Co., Ltd.
- Circuit board coupling structure21 May 2026US 2026/0143612 A1LG Energy Solution, Ltd.
- Plastic sleeve with embedded electrode and flexible pcb26 Feb 2026US 2026/0053550 A1Biosense Webster (Israel) Ltd.
- Heat dissipation module11 Dec 2025US 2025/0380352 A1ASUSTeK COMPUTER INC.
- Storage module double-layer positioning device set31 Jul 2025US 2025/0247961 A1Hanwit Precision Industries Ltd.
- Semiconductor device31 Jul 2025US 2025/0248015 A1Mitsubishi Electric Corporation
Most cited
By later US patents
- Flexible circuit sheet274US 9,226,689 B2Medtronic Xomed, Inc. · 2016
- Foldable display apparatus269US 9,348,450 B1LG Display Co., Ltd. · 2016
- Flexible cable for high-speed interconnect90US 7,148,428 B2Intel Corporation · 2006
- Apparatus with torsionally stressed conductors routed through a hollow articulated hinge85US 4,825,395 AHewlett-Packard Company · 1989
- Printed wiring board interconnection apparatus81US 4,298,237 ABell Telephone Laboratories, Incorporated · 1981