H05K 2201/055
Folded back on itself
H05K2201/055 (Folded back on itself) appears on 502 US grants and 554 published applications in this corpus.
Search patents in H05K- Granted patents
- 502
- Published applications
- 554
- Assignees
- 315
- Inventors
- 1,247
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 7 |
| 2003 | 6 | 3 |
| 2004 | 1 | 10 |
| 2005 | 5 | 18 |
| 2006 | 10 | 10 |
| 2007 | 10 | 17 |
| 2008 | 6 | 19 |
| 2009 | 11 | 23 |
| 2010 | 11 | 24 |
| 2011 | 13 | 18 |
| 2012 | 23 | 19 |
| 2013 | 15 | 20 |
| 2014 | 15 | 17 |
| 2015 | 28 | 36 |
| 2016 | 15 | 18 |
| 2017 | 20 | 35 |
| 2018 | 24 | 32 |
| 2019 | 41 | 35 |
| 2020 | 29 | 40 |
| 2021 | 41 | 35 |
| 2022 | 18 | 37 |
| 2023 | 35 | 29 |
| 2024 | 29 | 18 |
| 2025 | 23 | 19 |
| 2026 | 7 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser folded 3D electronics29 Sep 2026US 12,750,950 B2The United States of America as represented by the Secretary of the Army
- Fabrication of three-dimensional kirigami structures with tunable properties18 Aug 2026US 12,709,080 B2Massachusetts Institute of Technology
- Flexible connector with reduced torsional stiffness7 Jul 2026US 12,677,057 B2Cambridge Mechatronics Limited
- Driving mechanism23 Jun 2026US 12,666,128 B2Actutek Corporation
- Flexible wiring board and light control unit31 Mar 2026US 12,593,398 B2Toppan Inc.
- Wire harness6 Aug 2026US 2026/0229860 A1Yazaki Corporation
- Wire harness6 Aug 2026US 2026/0231341 A1Yazaki Corporation
- Wire harness and wire harness manufacturing method16 Jul 2026US 2026/0204458 A1Yazaki Corporation
- Display device16 Jul 2026US 2026/0206440 A1Semiconductor Energy Laboratory Co.Ltd.
- Flexible circuit board and ultrasonic probe18 Jun 2026US 2026/0173259 A1Wuhan United Imaging Healthcare Co., Ltd.
Most cited
By later US patents
- Bundled flexible flat circuit cable225US 8,872,032 B2Advanced Flexible Circuits Co., Ltd. · 2014
- Stacked configuration for integrated circuit devices177US 5,117,282 AHarris Corporation · 1992
- Composite interposer and method for producing a composite interposer161US 6,521,530 B2Fujitsu Limited · 2003
- Reduced cross-talk noise high density signal interposer with power and ground wrap154US 6,239,485 B1Fujitsu Limited · 2001
- Appendage mountable electronic devices conformable to surfaces111US 9,554,484 B2The Board of Trustees of the University of Illinois · 2017