H05K 13/082
Integration of non-optical monitoring devices, i.e. using non-optical inspection means
Official title: {Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays}
H05K13/082 (Integration of non-optical monitoring devices, i.e. using non-optical inspection means) appears on 168 US grants and 140 published applications in this corpus.
Search patents in H05K- Granted patents
- 168
- Published applications
- 140
- Assignees
- 101
- Inventors
- 424
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 1 | 0 |
| 2003 | 2 | 2 |
| 2004 | 1 | 4 |
| 2005 | 2 | 5 |
| 2006 | 3 | 3 |
| 2007 | 4 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 1 |
| 2010 | 1 | 4 |
| 2011 | 2 | 3 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 5 |
| 2015 | 3 | 4 |
| 2016 | 2 | 5 |
| 2017 | 4 | 11 |
| 2018 | 10 | 12 |
| 2019 | 10 | 10 |
| 2020 | 12 | 14 |
| 2021 | 11 | 11 |
| 2022 | 14 | 16 |
| 2023 | 8 | 8 |
| 2024 | 7 | 8 |
| 2025 | 7 | 4 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mounting apparatus, mounting method, and method for measuring height of substrate18 Aug 2026US 12,713,573 B2Fuji Corporation
- Data-analysis-based feedback of component positioning within an electronic assembly28 Jul 2026US 12,696,435 B2International Business Machines Corporation
- Manufacturing system, manufacturing method, control system, and control method12 May 2026US 12,628,325 B2Panasonic Intellectual Property Management Co., Ltd.
- Measuring device24 Mar 2026US 12,584,952 B2Fuji Corporation
- Manufacturing method and apparatus10 Feb 2026US 12,546,580 B2Renishaw PLC
- Component mounting apparatus and determination method25 Jun 2026US 2026/0181848 A1Fuji Corporation
- Spindle apparatus and cutting apparatus for semiconductor package14 May 2026US 2026/0131504 A1Samsung Electronics Co., Ltd.
- Component mounting machine and contact determination method9 Apr 2026US 2026/0097525 A1Fuji Corporation
- A sensor assembly, a component handling assembly, and a method of delivering a component15 Jan 2026US 2026/0016278 A1Ismeca Semiconductor Holding SA
- Wave height control for wave soldering1 Jan 2026US 2026/0001154 A1Schweitzer Engineering Laboratories, Inc.
Most cited
By later US patents
- Robotic end effector110US 4,657,470 AWestinghouse Electric Corp. · 1987
- Method of and apparatus for mounting electric components66US 4,794,689 AMatsushita Electric Industrial Co., Ltd. · 1989
- Vacuum clamping detection method and vacuum clamping detector66US 7,263,890 B2Koganei Corporation · 2007
- Broad band contactor assembly for testing integrated circuit devices62US 4,689,556 ADaymarc Corporation · 1987
- Monitor for detecting the absence of an electronic component on a vacuum pickup40US 5,207,467 AInternational Business Machines Corporation · 1993