H01P 3/085
Triplate lines
Official title: {Triplate lines}
H01P3/085 (Triplate lines) appears on 389 US grants and 363 published applications in this corpus.
Search patents in H01P- Granted patents
- 389
- Published applications
- 363
- Assignees
- 184
- Inventors
- 742
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 3 | 1 |
| 2002 | 6 | 5 |
| 2003 | 11 | 5 |
| 2004 | 4 | 7 |
| 2005 | 5 | 7 |
| 2006 | 2 | 8 |
| 2007 | 8 | 7 |
| 2008 | 6 | 7 |
| 2009 | 3 | 8 |
| 2010 | 6 | 6 |
| 2011 | 10 | 8 |
| 2012 | 4 | 6 |
| 2013 | 7 | 12 |
| 2014 | 10 | 28 |
| 2015 | 16 | 32 |
| 2016 | 25 | 14 |
| 2017 | 35 | 31 |
| 2018 | 28 | 23 |
| 2019 | 19 | 22 |
| 2020 | 24 | 27 |
| 2021 | 13 | 13 |
| 2022 | 13 | 16 |
| 2023 | 16 | 38 |
| 2024 | 19 | 18 |
| 2025 | 24 | 10 |
| 2026 | 12 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Communication apparatus and communication system8 Sep 2026US 12,731,905 B2Canon Kabushiki Kaisha
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- High-frequency line connection structure11 Aug 2026US 12,706,363 B2NTT, Inc.
- Transmission line including a multilayer body having a signal conductor layer, ground conductor layers and a hollow portion of varying width11 Aug 2026US 12,706,364 B2Murata Manufacturing Co., Ltd.
- Self-carrying conductive strip for a transmission line6 Aug 2026US 2026/0229761 A1Telefonaktiebolaget LM Ericsson (publ)
- Electronic component6 Aug 2026US 2026/0229768 A1Murata Manufacturing Co., Ltd.
- Methods for fabricating a window panel having an antenna disposed therein23 Apr 2026US 2026/0112805 A1Taoglas Group Holdings Limited
- Superconductor ribbon cables with double stripline structures19 Feb 2026US 2026/0051423 A1International Business Machines Corporation
- Transmission line structure for reducing insertion loss and electronic device including the same13 Nov 2025US 2025/0350012 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Strip line circuit component and method of manufacture170US 4,821,007 ATektronix, Inc. · 1989
- Strip line cable using a porous, crystalline polymer dielectric tape131US 4,382,236 AJunkosha Inc. · 1983
- Wiring board, wiring board fabrication method, and semiconductor package112US 6,353,189 B1Kabushiki Kaisha Toshiba · 2002
- Connector using a material with microwave absorbing properties111US 5,796,323 ATDK Corporation · 1998
- Impedance matching stripline transition for microwave signals91US 4,494,083 ATelefonaktiebolaget L M Ericsson · 1985