H01P 3/084
Suspended microstriplines
Official title: {Suspended microstriplines}
H01P3/084 (Suspended microstriplines) appears on 44 US grants and 50 published applications in this corpus.
Search patents in H01P- Granted patents
- 44
- Published applications
- 50
- Assignees
- 38
- Inventors
- 151
- Latest grant
- 5 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 2 | 1 |
| 2004 | 1 | 2 |
| 2005 | 2 | 2 |
| 2006 | 0 | 2 |
| 2007 | 2 | 2 |
| 2008 | 2 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 0 |
| 2011 | 1 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 4 |
| 2015 | 2 | 7 |
| 2016 | 3 | 0 |
| 2017 | 5 | 5 |
| 2018 | 2 | 2 |
| 2019 | 1 | 2 |
| 2020 | 3 | 2 |
| 2021 | 1 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 4 |
| 2024 | 2 | 1 |
| 2025 | 3 | 7 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transmission line structure having a signal line spaced apart from ground by an air layer and the signal line is supported at a center part thereof5 Aug 2025US 12,381,300 B2Samsung Electronics Co., Ltd.
- Adapter device comprising a coaxial cable coupled to an air-dielectric microstrip and including a non-flat capacitive coupling formed by a non-flat ground plane with a non-flat metal part5 Aug 2025US 12,381,301 B2Huawei Technologies Co., Ltd.
- Antenna structure and electronic device including the same17 Jun 2025US 12,334,641 B2Samsung Electronics Co., Ltd.
- Embedded microstrip transmission line10 Dec 2024US 12,166,260 B2International Business Machines Corporation
- Feeder line and antenna device using same10 Sep 2024US 12,088,026 B2Mitsubishi Electric Corporation
- Self-carrying conductive strip for a transmission line6 Aug 2026US 2026/0229761 A1Telefonaktiebolaget LM Ericsson (publ)
- Antenna assembly and antenna4 Dec 2025US 2025/0372875 A1Huawei Technologies Co., Ltd.
- Transmission line structure for reducing insertion loss and electronic device including the same13 Nov 2025US 2025/0350012 A1Samsung Electronics Co., Ltd.
- Antenna structure and electronic device including the same25 Sep 2025US 2025/0300367 A1Sumsung Electronics Co., Ltd.
- Metal Structure for a Component Carrier and Manufacturing Method25 Sep 2025US 2025/0301566 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Microstrip arrangement220US 6,266,016 B1Telefonaktiebolaget LM Ericsson (publ) · 2001
- Millimeter waveguide and a circuit apparatus using the same82US 5,990,768 AMatsushita Electric Industrial Co., Ltd. · 1999
- Microelectromechanical RF and microwave frequency power limiter and electrostatic device protection71US 6,504,447 B1HRL Laboratories, LLC · 2003
- Microelectromechanical RF and microwave frequency power regulator70US 6,847,266 B2HRL Laboratories, LLC · 2005
- Flex-circuit-based high speed transmission line55US 6,888,427 B2Xandex, Inc. · 2005