Millimeter waveguide and a circuit apparatus using the same

A circuit apparatus comprising:

• a millimeter waveguide comprising:
• a first single crystal substrate having a groove therein;
• a conductor film to be grounded on a surface of said groove and a surface of said first single crystal substrate connecting to said surface of groove;
• a second single crystal substrate covering said conductor film and having a via hole;
• a first microstrip line on a surface of said second single crystal substrate, exposed to a cavity defined by said conductor film and said second crystal substrate;
• a second microstrip line on an opposite surface of said second single crystal substrate, connecting to said first microstrip line via said via hole;
• and
• a third microstrip line on said opposite surface apart from said second microstrip line;
• an active circuit chip for performing a predetermined circuit operation;
• and
• connecting means for mechanically and electrically connecting said active circuit to said third microstrip line and to said second microstrip line, wherein there is a responsive relation between said first and third microstrip lines through said active circuit, said second microstrip line, and said via hole.

A millimeter waveguide comprising:

• a first single crystal substrate having a groove therein;
• a conductor film to be grounded on a surface of said groove and a surface of said first single crystal substrate connected to said surface of said groove;
• a second single crystal substrate covering said conductor film and having a protrusion toward said groove;
• and
• a microstrip line on a surface of said protrusion, exposed to a cavity defined by said conductor film and said second crystal substrate, a height of said protrusion being less than a depth of said groove.

A circuit apparatus comprising:

• a millimeter waveguide comprising:
• a first single crystal substrate having a groove therein;
• a conductor film to be grounded on a surface of said groove and a surface of said first single crystal substrate connecting to said surface of said groove;
• a second single crystal substrate covering said second conductor film and having a protrusion toward said groove and a via hole therein;
• and
• a first microstrip line on a surface of said protrusion, exposed to a cavity defined by said conductor film and said second crystal substrate, a height of said protrusion being less than a depth of said groove;
• a second microstrip line on a surface of said second single crystal substrate opposite to said protrusion, connecting to said first microstrip line via said via hole;
• and
• a third microstrip line on said surface of said second single crystal substrate apart from said second microstrip line;
• and
• an active circuit chip for performing a predetermined circuit operation;
• and
• connecting means for mechanically and electrically connecting said active circuit to said third microstrip line and to said second microstrip line, wherein there is a responsive relation between said first and third microstrip lines through said active circuit, said second microstrip line, and said via hole.

A millimeter waveguide comprising:

• a first single crystal substrate;
• a conductor film to be grounded on said first single crystal substrate;
• a second single crystal substrate on said conductor film, having a groove on a side facing said first crystal substrate;
• and
• a microstrip line on a bottom surface of said groove.

A millimeter waveguide comprising:

• a first single crystal substrate having a hollow portion therein;
• a first conductor film to be grounded on a surface of said hollow portion and a surface of said first single crystal substrate connecting to said surface of said hollow portion;
• a second conductor film covering said hollow portion and said surface of said first single crystal substrate, having a first through hole above said hollow portion;
• a second single crystal substrate on said second conductor film, having a second through hole connecting to said first hole;
• and
• a microstrip line on a surface of said second single crystal substrate opposite to said first crystal substrate;
• and
• a probe extending from said microstrip line through said first and second through holes, exposed to a cavity defined by said first and second conductor films.

A millimeter waveguide comprising:

• a first single crystal substrate having a hollow portion therein;
• a first conductor film to be grounded on a surface of said hollow portion and a surface of said first single crystal substrate connecting to said surface of said hollow portion;
• a second conductor film covering said hollow portion and said surface of said first single crystal substrate, having a slot above said hollow portion;
• a second single crystal substrate on said second conductor film;
• and
• a microstrip line on a surface of said second single crystal substrate opposite to said first crystal substrate, confronting a cavity defined by said first and second conductor films through said slot, and said second single crystal substrate to electromagnetically couple to said cavity.

A circuit apparatus comprising:

• a millimeter waveguide comprising:
• a first single crystal substrate;
• a conductor film to be grounded on a surface of said first single crystal substrate;
• a second single crystal substrate on said second conductor film, having a groove on side of said first crystal substrate and a via hole;
• and
• a first microstrip line on a bottom surface of said groove;
• a second microstrip line on a surface of said second single crystal substrate opposite to said groove, connecting to said first microstrip line via said via hole;
• and
• a third microstrip line on said surface of said second signal crystal substrate apart from said second microstrip line;
• an active circuit chip for performing a predetermined circuit operation;
• and
• connecting means for mechanically and electrically connecting said active circuit to said third microstrip line and to said second microstrip line, wherein there is a responsive relation between said first and third microstrip lines through said active circuit, said second microstrip line, and said via hole.