H01P 3/082
Multilayer dielectric
Official title: {Multilayer dielectric}
H01P3/082 (Multilayer dielectric) appears on 177 US grants and 184 published applications in this corpus.
Search patents in H01P- Granted patents
- 177
- Published applications
- 184
- Assignees
- 97
- Inventors
- 347
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 4 |
| 2010 | 0 | 3 |
| 2011 | 0 | 2 |
| 2012 | 3 | 6 |
| 2013 | 3 | 7 |
| 2014 | 2 | 8 |
| 2015 | 14 | 21 |
| 2016 | 16 | 16 |
| 2017 | 18 | 21 |
| 2018 | 21 | 15 |
| 2019 | 14 | 10 |
| 2020 | 16 | 19 |
| 2021 | 7 | 11 |
| 2022 | 19 | 15 |
| 2023 | 9 | 13 |
| 2024 | 11 | 10 |
| 2025 | 10 | 1 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- Transmission line including a multilayer body having a signal conductor layer, ground conductor layers and a hollow portion of varying width11 Aug 2026US 12,706,364 B2Murata Manufacturing Co., Ltd.
- Filter device2 Jun 2026US 12,647,088 B2Murata Manufacturing Co., Ltd.
- Resistive stabilization of a transmission line using a group of conductive fill components which are adjacent to and separated from the transmission line31 Mar 2026US 12,592,467 B2MACOM Technology Solutions Holdings, Inc.
- Multilayer substrate and manufacturing method therefor30 Sep 2025US 12,431,603 B2Murata Manufacturing Co., Ltd.
- Signal transmission device having multilayer structure10 Sep 2026US 2026/0269445 A1M31 Technology Corporation
- Lossy matching network and wideband stabilizer30 Jul 2026US 2026/0221641 A1MACOM Technology Solutions Holdings, Inc.
- Electronic device11 Sep 2025US 2025/0286260 A1Innolux Corporation
- Circuit board21 Nov 2024US 2024/0389221 A1KYOCERA Corporation
- Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof14 Nov 2024US 2024/0379592 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Apparatus and method for utilizing a lossy dielectric substrate in a high speed digital system31US 6,621,373 B1Rambus Inc. · 2003
- Low loss architecture for superconducting qubit circuits25US 10,305,015 B1International Business Machines Corporation · 2019
- Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer23US 9,972,589 B1Intel Corporation · 2018
- Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line21US 10,826,147 B2Raytheon Company · 2020
- Multi-tunable superconducting circuits20US 8,975,912 B2International Business Machines Corporation · 2015