Low loss architecture for superconducting qubit circuits

A method of forming a structure, the method comprising:

• disposing an inductive element of a resonator on a first surface;
• and
• disposing a first portion of a capacitive element of the resonator and at least one qubit on a second surface, wherein a second portion of the capacitive element of the resonator is on the first surface;
• wherein an interconnect structure connecting the first and second portions forms an equipotential between the interconnect structure, the first portion, and the second portion.

A method of forming a structure, the method comprising:

• disposing inductive elements of resonators and first portions of capacitive elements of the resonators on a first surface;
• and
• disposing at least two qubits coupled by a bus resonator on a second surface, the second surface comprising second portions of the capacitive elements of the resonators;
• wherein the capacitive elements respectively comprise an interconnect structure coupling the first and second surfaces, the interconnect structure being selected from the group consisting of a solder bump and a through-silicon via.

A superconducting qubit circuit comprising:

• readout resonators configured to respectively couple to qubits;
• one or more bus resonators configured to couple at least two of the qubits together;
• a first surface comprising inductive elements of the readout resonators and first portions of capacitive elements of the readout resonators;
• and
• a second surface comprising the qubits and second portions of the capacitive elements of the readout resonators, the first and second surfaces being different circuit planes;
• wherein the capacitive elements respectively comprise an interconnect structure coupling the first and second surfaces, the interconnect structure being selected from the group consisting of a solder bump and a through-silicon via.