H01P 3/006
Conductor backed coplanar waveguides
Official title: {Conductor backed coplanar waveguides}
H01P3/006 (Conductor backed coplanar waveguides) appears on 98 US grants and 120 published applications in this corpus.
Search patents in H01P- Granted patents
- 98
- Published applications
- 120
- Assignees
- 95
- Inventors
- 264
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 3 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 0 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 4 |
| 2010 | 1 | 1 |
| 2011 | 2 | 7 |
| 2012 | 4 | 4 |
| 2013 | 5 | 6 |
| 2014 | 2 | 5 |
| 2015 | 4 | 3 |
| 2016 | 4 | 5 |
| 2017 | 6 | 3 |
| 2018 | 5 | 13 |
| 2019 | 2 | 6 |
| 2020 | 11 | 8 |
| 2021 | 6 | 6 |
| 2022 | 6 | 5 |
| 2023 | 7 | 12 |
| 2024 | 7 | 12 |
| 2025 | 5 | 9 |
| 2026 | 8 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- Transmission line including a multilayer body having a signal conductor layer, ground conductor layers and a hollow portion of varying width11 Aug 2026US 12,706,364 B2Murata Manufacturing Co., Ltd.
- Waveguide device including a waveguide member in an inorganic material substrate attached to a support substrate and with a low-loss dielectric portion28 Jul 2026US 12,695,168 B2NGK Insulators, Ltd.
- Substrate with a grounded coplanar waveguide on a glass core16 Jun 2026US 12,658,569 B2Intel Corporation
- Transmission line comprising a signal conducting layer including a signal line covered by a shielding layer and having a slot over the signal line9 Jun 2026US 12,651,815 B2Skyworks Solutions, Inc.
- Adjustable power splitter/combiner19 Mar 2026US 2026/0081332 A1NXP B. V.
- Controlling impedance and phase shift of a transmission line19 Mar 2026US 2026/0082476 A1NXP USA, Inc.
- Antenna module implemented in multi-layer package and electronic device comprising the same5 Mar 2026US 2026/0066524 A1LG Electronics Inc.
- Flexible printed circuit cable30 Oct 2025US 2025/0338395 A1Microsoft Technology Licensing, LLC
- Waveguide device15 May 2025US 2025/0158263 A1NGK Insulators, Ltd.
Most cited
By later US patents
- Connector using a material with microwave absorbing properties111US 5,796,323 ATDK Corporation · 1998
- Flexible differential interconnect cable with isolated high frequency electrical transmission line103US 7,145,411 B1Applied Micro Circuits Corporation · 2006
- Flexible interconnect cable with grounded coplanar waveguide74US 7,336,139 B2Applied Micro Circuits Corporation · 2008
- Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line21US 10,826,147 B2Raytheon Company · 2020
- Electronic filtering part using a material with microwave absorbing properties21US 5,594,397 ATDK Corporation · 1997