Antenna module implemented in multi-layer package and electronic device comprising the same

An antenna module, comprising:

• a multi-layer printed circuit board (PCB);
• a radio frequency integrated circuit (RFIC) disposed on a first surface of a plurality of outermost surfaces of the PCB;
• a first array antenna disposed on a second surface, perpendicular to the first surface, of the outermost surfaces of the PCB;
• a second array antenna disposed on a third surface, perpendicular to the first surface and the second surface, of the outermost surfaces of the PCB;
• a first coplanar waveguide (CPW) formed within a plurality of layers of the PCB and electrically connecting the RFIC to the first array antenna;
• a second CPW formed within the plurality of layers of the PCB and electrically connecting the RFIC to the second array antenna;
• and
• at least one first ground layer disposed between a first signal layer, on which the first CPW is disposed, and a second signal layer, on which the second CPW is disposed,
• wherein the first signal layer and the second signal layer are different layers of the plurality of layers.