H01P 1/047
Strip line joints
Official title: {Strip line joints}
H01P1/047 (Strip line joints) appears on 219 US grants and 191 published applications in this corpus.
Search patents in H01P- Granted patents
- 219
- Published applications
- 191
- Assignees
- 147
- Inventors
- 545
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 1 |
| 2002 | 14 | 9 |
| 2003 | 7 | 10 |
| 2004 | 14 | 16 |
| 2005 | 12 | 17 |
| 2006 | 9 | 7 |
| 2007 | 11 | 7 |
| 2008 | 4 | 2 |
| 2009 | 3 | 7 |
| 2010 | 6 | 10 |
| 2011 | 4 | 5 |
| 2012 | 3 | 1 |
| 2013 | 4 | 7 |
| 2014 | 3 | 2 |
| 2015 | 4 | 7 |
| 2016 | 8 | 2 |
| 2017 | 5 | 4 |
| 2018 | 4 | 2 |
| 2019 | 4 | 5 |
| 2020 | 4 | 7 |
| 2021 | 5 | 10 |
| 2022 | 7 | 16 |
| 2023 | 9 | 15 |
| 2024 | 12 | 12 |
| 2025 | 15 | 6 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated curcuit to dielectric substrate transition25 Aug 2026US 12,721,171 B2Analog Devices International Unlimited Company
- Semiconductor device and method for adjusting phase characteristics thereof18 Aug 2026US 12,713,959 B2Kabushiki Kaisha Toshiba
- Microelectronic device package with integral waveguide transition4 Aug 2026US 12,700,655 B2Texas Instruments Incorporated
- Antenna module, connection member, and communication device including the same24 Mar 2026US 12,587,216 B2Murata Manufacturing Co., Ltd.
- Coupling structure and antenna module9 Dec 2025US 12,494,565 B2Murata Manufacturing Co., Ltd.
- Cryogenic die to die electrical connectors2 Jul 2026US 2026/0191119 A1Psiquantum, Corp.
- Connection structure and waveguide28 May 2026US 2026/0149158 A1Kabushiki Kaisha Toshiba
- Additively manufactured coaxial interconnects14 May 2026US 2026/0136942 A1BAE Systems Information and Electronic Systems Integration Inc.
- Substrate structural unit, antenna module, and communication device8 Jan 2026US 2026/0011921 A1Murata Manufacturing Co., Ltd.
- Planar balun structure12 Jun 2025US 2025/0189623 A1NXP B. V.
Most cited
By later US patents
- Single substrate microwave radar transceiver including flip-chip integrated circuits139US 5,115,245 ADelco Electronics Corporation · 1992
- Wiring board, wiring board fabrication method, and semiconductor package112US 6,353,189 B1Kabushiki Kaisha Toshiba · 2002
- RF package with multi-layer substrate having coplanar feed through and connection interface103US 6,774,748 B1NEC Corporation · 2004
- Assembly of microwave components91US 4,810,981 AGeneral Microwave Corporation · 1989
- Wiring board equipped with a line for transmitting a high frequency signal91US 5,982,256 AKYOCERA Corporation · 1999