Semiconductor device and method for adjusting phase characteristics thereof
AssigneeKabushiki Kaisha Toshiba
InventorKoji Takahashi
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Abstract
According to one embodiment, a semiconductor device includes a base, a first circuit board provided on the base, a second circuit board provided on the base at a certain interval from the first circuit board, a first connector provided with a first wire that is bridged between an upper surface of the first circuit board and an upper surface of the second circuit board to connect the two boards, and a first ferrite arranged on the base and directly below the first wire between the first circuit board and the second circuit board.
Claims10
A semiconductor device comprising:
- a base;
- a first circuit board provided on the base;
- a second circuit board provided on the base at a certain interval from the first circuit board;
- a first connector provided with a first wire that is bridged between an upper surface of the first circuit board and an upper surface of the second circuit board to connect the two boards;
- and
- a first ferrite arranged on the base and directly below the first wire between the first circuit board and the second circuit board, wherein
- the first connector is provided with a plurality of the first wires that are bridged in parallel at a plurality of locations between the upper surface of the first circuit board and the upper surface of the second circuit board to connect the two boards, and
- the first ferrite is a rectangular body with both side surfaces in a longitudinal direction facing side surfaces of the first circuit board and the second circuit board, respectively, and with both ends in the longitudinal direction having a length exceeding a width of an alignment direction of the plurality of first wires, and is arranged directly below all of the plurality of first wires.
A method for adjusting phase characteristics of a semiconductor device, comprising:
- providing a first circuit board and a second circuit board at certain intervals on a base;
- bridging a first wire between an upper surface of the first circuit board and an upper surface of the second circuit board to connect the two boards;
- and
- arranging a first ferrite on the base and directly below the first wire between the first circuit board and the second circuit board to adjust phase characteristics of the first wire.
Dependencies are inferred from the claim text.