H01F 27/40
Structural association with built-in electric component
Official title: Structural association with built-in electric component, e.g. fuse
H01F27/40 (Structural association with built-in electric component) appears on 1,403 US grants and 1,643 published applications in this corpus.
Search patents in H01F- Granted patents
- 1,403
- Published applications
- 1,643
- Assignees
- 728
- Inventors
- 3,603
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 9 | 0 |
| 1978 | 9 | 0 |
| 1979 | 6 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 8 | 0 |
| 1983 | 7 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 4 | 0 |
| 1987 | 6 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 0 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 5 |
| 2002 | 10 | 13 |
| 2003 | 13 | 19 |
| 2004 | 12 | 16 |
| 2005 | 18 | 25 |
| 2006 | 20 | 20 |
| 2007 | 19 | 36 |
| 2008 | 20 | 52 |
| 2009 | 27 | 55 |
| 2010 | 45 | 47 |
| 2011 | 33 | 33 |
| 2012 | 27 | 28 |
| 2013 | 31 | 37 |
| 2014 | 28 | 58 |
| 2015 | 38 | 60 |
| 2016 | 44 | 53 |
| 2017 | 42 | 82 |
| 2018 | 73 | 119 |
| 2019 | 104 | 123 |
| 2020 | 111 | 111 |
| 2021 | 89 | 115 |
| 2022 | 101 | 147 |
| 2023 | 100 | 106 |
| 2024 | 103 | 99 |
| 2025 | 85 | 90 |
| 2026 | 52 | 94 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integral transformer junction module6 Oct 2026US 12,755,887 B2
- Isolator22 Sep 2026US 12,744,153 B2Kabushiki Kaisha Toshiba
- Transformer monitoring management system15 Sep 2026US 12,738,766 B2Fortune Electric Co., Ltd.
- Coil device, power supply device, and detection device25 Aug 2026US 12,715,316 B2IHI Corporation
- Device module, manufacturing method therefor, and inductor-capacitor array25 Aug 2026US 12,721,156 B2Sg Micro Corp
- Integrated inductor-capacitor structure for voltage converters24 Sep 2026US 2026/0290673 A1Micron Technology, Inc.
- Air-cell rupture diagnosis method and system24 Sep 2026US 2026/0290683 A1Fortune Electric Co., Ltd.
- Embedded lc modules for packaged semiconductor devices24 Sep 2026US 2026/0293760 A1Saras Micro Devices, Inc.
- Distribution transformer system and methods thereof17 Sep 2026US 2026/0279659 A1Ubicquia, Inc.
- Voltage regulator module and semiconductor combination10 Sep 2026US 2026/0269120 A1MetaPWR Electronics Co., Ltd.
Most cited
By later US patents
- Inductively powered sleeve for mobile electronic device150US 7,855,529 B2ConvenientPower HK Ltd. · 2010
- System and method for providing a low power receiver design114US 6,377,315 B1Broadcom Corporation · 2002
- Compact integration of LC resonators107US 7,548,138 B2Intel Corporation · 2009
- Integrated RJ-45 magnetics with phantom power provision106US 6,541,878 B1Cisco Technology, Inc. · 2003
- Superconducting quick switch86US 8,134,434 B2Quantum Design, Inc. · 2012