Device module, manufacturing method therefor, and inductor-capacitor array

An inductor-capacitor array, comprising:

• a first conductive layer, a second conductive layer, and a lamination structure between the first conductive layer and the second conductive layer, the lamination structure comprising an inductor layer and a capacitor layer,
• wherein the capacitor layer comprises:
• an upper electrode plate below the first conductive layer;
• a lower electrode plate above the inductor layer;
• and a capacitor dielectric layer between the upper electrode plate and the lower electrode plate, wherein the first electrode plate of each of a plurality of capacitors is formed in the upper electrode plate, the second electrode plate of each of the plurality of capacitors is formed in the lower electrode plate, and each of a plurality of via electrodes penetrates through the upper electrode plate, the capacitor dielectric layer, and the lower electrode plate;
• a plurality of inductors are formed in the inductor layer, each of which is arranged along a thickness direction of the inductor layer so that a first terminal of the inductor is electrically coupled with the first conductive layer through corresponding one of the via electrodes, and a second terminal of the inductor is electrically coupled with the second conductive layer.