Embedded lc modules for packaged semiconductor devices

A method of manufacturing a semiconductor device, the method comprising:

• embedding a first inductor in a substrate core of a substrate;
• embedding a first capacitor in the substrate core, the first inductor and the first capacitor defining a first LC module;
• embedding a second inductor in the substrate core;
• embedding a second capacitor in the substrate core, the second inductor and the second capacitor defining a second LC module that is electrically isolated from the first LC module;
• providing an input terminal of the first LC module on a first side of the substrate core connected to an input of the first inductor, the input terminal of the first LC module being configured to receive an input voltage Vi1 and an input current Ii1 that vary with time;
• providing an input terminal of the second LC module on the first side of the substrate core connected to an input of the second inductor, the input terminal of the second LC module being configured to receive an input voltage Vi2 and an input current Ii2 that vary with time;
• providing an output terminal of the first LC module on a second side of the substrate core connected to an output of the first inductor and to an anode of the first capacitor, the output terminal of the first LC module being configured to output an output voltage Vo1 < Vi1 and an output current Io1 that vary with time;
• providing an output terminal of the second LC module on the second side of the substrate core connected to an output of the second inductor and to an anode of the second capacitor, the output terminal of the second LC module being configured to output an output voltage Vo2 < Vi2 and an output current Io2 that vary with time;
• providing a first sense terminal on the first side of the substrate core connected to the output of the first inductor and to the anode of the first capacitor, the first sense terminal providing a feedback loop for regulating an output of a prior stage active component;
• providing a second sense terminal on the first side of the substrate core connected to the output of the second inductor and to the anode of the second capacitor, the second sense terminal providing a feedback loop for regulating an output of a prior stage active component;
• and
• mounting an integrated circuit die on the substrate such that the first LC module is in alignment with a first power rail of the integrated circuit die and the second LC module is in alignment with a second power rail of the integrated circuit die.

A method of manufacturing a semiconductor device, the method comprising:

• providing a first LC module including a first inductor and a first capacitor;
• embedding the first LC module in a substrate core of a substrate;
• providing an input terminal of the first LC module on a first side of the substrate core connected to an input of the first inductor, the input terminal of the first LC module being configured to receive an input voltage Vi and an input current Ii that vary with time;
• providing an output terminal of the first LC module on a second side of the substrate core connected to an output of the first inductor and to an anode of the first capacitor, the output terminal of the first LC module being configured to output an output voltage Vo < Vi and an output current Io that vary with time;
• providing a sense terminal on the first side of the substrate core connected to the output of the first inductor and to the anode of the first capacitor, the sense terminal providing a feedback loop for regulating an output of a prior stage active component;
• and
• mounting an integrated circuit die on the substrate such that the first LC module is in alignment with a first power rail of the integrated circuit die.