H01F 27/22
Cooling by heat conduction through solid or powdered fillings
H01F27/22 (Cooling by heat conduction through solid or powdered fillings) appears on 439 US grants and 616 published applications in this corpus.
Search patents in H01F- Granted patents
- 439
- Published applications
- 616
- Assignees
- 283
- Inventors
- 1,339
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 0 |
| 2002 | 4 | 1 |
| 2003 | 5 | 5 |
| 2004 | 2 | 8 |
| 2005 | 5 | 7 |
| 2006 | 4 | 9 |
| 2007 | 5 | 12 |
| 2008 | 9 | 11 |
| 2009 | 5 | 16 |
| 2010 | 10 | 9 |
| 2011 | 10 | 5 |
| 2012 | 12 | 10 |
| 2013 | 5 | 14 |
| 2014 | 18 | 32 |
| 2015 | 23 | 20 |
| 2016 | 14 | 24 |
| 2017 | 14 | 36 |
| 2018 | 19 | 43 |
| 2019 | 23 | 40 |
| 2020 | 35 | 51 |
| 2021 | 20 | 46 |
| 2022 | 42 | 38 |
| 2023 | 42 | 49 |
| 2024 | 25 | 46 |
| 2025 | 29 | 46 |
| 2026 | 19 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inductor connectivity and assemblies15 Sep 2026US 12,738,406 B2Infineon Technologies Austria AG
- Supply circuit for power module with built-in isolation transformer and associated power module18 Aug 2026US 12,712,109 B2Safran
- Reactor4 Aug 2026US 12,700,535 B2ABB E-mobility B.V.
- Inductor and electronic device28 Jul 2026US 12,695,020 B2Huawei Digital Power Technologies Co., Ltd.
- Coil device14 Jul 2026US 12,683,059 B2TDK Corporation
- Winding structure1 Oct 2026US 2026/0302039 A1Delta Electronics, Inc.
- Systems and methods for topographic mapping to design magnetic cores24 Sep 2026US 2026/0290671 A1UT-Battelle, LLC
- Magnetic integrated component17 Sep 2026US 2026/0279641 A1Delta Electronics, Inc.
- Magnetic component, integrated magnetic device, and three-phase converter17 Sep 2026US 2026/0279643 A1Delta Electronics (Shanghai) Co., Ltd.
- Coil component and filter stage20 Aug 2026US 2026/0245782 A1
Most cited
By later US patents
- Switching electrical power supply utilizing miniature inductors integrally in a PCB210US 4,622,627 ATheta-J Corporation · 1986
- Portable self powered line mountable device for measuring and transmitting ambient temperature191US 9,380,857 B22016
- Air and water cooled modulator146US 5,448,580 AThe United States of America as represented by the United States Department of Energy · 1995
- Transformer and inductor modules having directly bonded terminals and heat-sink fins117US 6,578,253 B1FMTT, Inc. · 2003
- Integration of planar transformer and/or planar inductor with power switches in power converter83US 7,289,329 B2Siemens VDO Automotive Corporation · 2007