Inductor and electronic device

Abstract

An inductor (100) is provided, and includes an inductor winding (10), a housing (20), and a thermally conductive packaging material (30). The inductor winding is disposed in the housing. The thermally conductive packaging material is potted in the housing to fill a gap between the inductor winding and the housing. The thermally conductive packaging material includes a first packaging layer (31) and a second packaging layer (32), and a coefficient of thermal conductivity of the first packaging layer is greater than a coefficient of thermal conductivity of the second packaging layer. The housing includes a heat dissipation wall (21) and a packaging wall (22), and the first packaging layer is closer to the heat dissipation wall than the second packaging layer. Heat generated by the inductor can be dissipated after being transmitted to each surface of the housing through the thermally conductive packaging material.

Dependencies are inferred from the claim text.