H01F 27/022
Encapsulation
Official title: {Encapsulation}
H01F27/022 (Encapsulation) appears on 656 US grants and 882 published applications in this corpus.
Search patents in H01F- Granted patents
- 656
- Published applications
- 882
- Assignees
- 303
- Inventors
- 1,736
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 0 |
| 2002 | 4 | 10 |
| 2003 | 9 | 9 |
| 2004 | 8 | 14 |
| 2005 | 15 | 17 |
| 2006 | 15 | 14 |
| 2007 | 14 | 21 |
| 2008 | 9 | 19 |
| 2009 | 7 | 13 |
| 2010 | 20 | 14 |
| 2011 | 11 | 6 |
| 2012 | 7 | 18 |
| 2013 | 9 | 24 |
| 2014 | 12 | 30 |
| 2015 | 18 | 33 |
| 2016 | 26 | 27 |
| 2017 | 31 | 40 |
| 2018 | 26 | 57 |
| 2019 | 32 | 67 |
| 2020 | 33 | 57 |
| 2021 | 49 | 66 |
| 2022 | 53 | 68 |
| 2023 | 43 | 70 |
| 2024 | 57 | 80 |
| 2025 | 45 | 71 |
| 2026 | 35 | 37 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inductance element and inductance element fabrication method6 Oct 2026US 12,755,886 B2Lapis Semiconductor Co., Ltd.
- Coil member and camera module comprising same15 Sep 2026US 12,738,405 B2LG Innotek Co., Ltd.
- Coil component15 Sep 2026US 12,738,409 B2Samsung Electro-Mechanics Co., Ltd.
- Magnetic component18 Aug 2026US 12,712,110 B2Cyntec Co., Ltd.
- Coupled inductor18 Aug 2026US 12,712,116 B2Cyntec Co., Ltd.
- Transformer core insulating cover1 Oct 2026US 2026/0302035 A1ABB Schweiz AG
- Coil component1 Oct 2026US 2026/0302036 A1TDK Corporation
- Coil component, and method for manufacturing coil component20 Aug 2026US 2026/0245781 A1Delta Electronics (Japan), Inc.
- Magnetic Device Having Shielding Layer20 Aug 2026US 2026/0245788 A1Cyntec Co., Ltd.
- Coil device30 Jul 2026US 2026/0221327 A1TDK Corporation
Most cited
By later US patents
- Switching electrical power supply utilizing miniature inductors integrally in a PCB210US 4,622,627 ATheta-J Corporation · 1986
- Magnetic element and method of manufacturing the same114US 6,392,525 B1Matsushita Electric Industrial Co., Ltd. · 2002
- Wire wound electronic component84US 6,198,373 B1Taiyo Yuden Co., Ltd. · 2001
- Encapsulated package for power magnetic devices and method of manufacture therefor62US 5,787,569 ALucent Technologies Inc. · 1998
- Wireless power supply system and multi-layer shim assembly60US 9,209,627 B2Access Business Group International LLC · 2015