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AssigneeLucent Technologies Inc.
InventorsAshraf Wagih Lotfi, John David Weld, Karl Erich Wolf, William Lonzo Woods
Estimating the term…
An encapsulated package for a power magnetic device and a method of manufacture therefor. The power magnetic device has a magnetic core subject to magnetostriction when placed under stress. The package includes: (1) compliant material disposed about at least a portion of the magnetic core and (2) an encapsulant substantially surrounding the compliant material and the magnetic core, the compliant material providing a medium for absorbing stress between the encapsulant and the magnetic core, the compliant material reducing the magnetostriction upon the magnetic core caused by the stress from the encapsulant. In one embodiment, the encapsulant includes a vent to an environment surrounding the package. The vent provides pressure relief for the compliant material, allowing the compliant material to substantially eliminate the magnetostrictive effects.
An encapsulated package for a power magnetic device, said power magnetic device having a magnetic core subject to magnetostriction when placed under stress, said package comprising:
A method of manufacturing an encapsulated package for a power magnetic device, said power magnetic device having a magnetic core subject to magnetostriction when placed under stress, said method comprising the steps of:
An encapsulated power supply module, said module including a power magnetic device having a magnetic core subject to magnetostriction when placed under stress, said module comprising:
Dependencies are inferred from the claim text.