H01F 2017/048
With encapsulating core
Official title: {with encapsulating core, e.g. made of resin and magnetic powder}
H01F2017/048 (With encapsulating core) appears on 1,048 US grants and 1,663 published applications in this corpus.
Search patents in H01F- Granted patents
- 1,048
- Published applications
- 1,663
- Assignees
- 191
- Inventors
- 1,808
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 9 |
| 2005 | 3 | 9 |
| 2006 | 5 | 20 |
| 2007 | 12 | 16 |
| 2008 | 10 | 19 |
| 2009 | 10 | 23 |
| 2010 | 16 | 36 |
| 2011 | 14 | 19 |
| 2012 | 13 | 18 |
| 2013 | 11 | 26 |
| 2014 | 17 | 29 |
| 2015 | 26 | 25 |
| 2016 | 14 | 75 |
| 2017 | 20 | 60 |
| 2018 | 48 | 94 |
| 2019 | 53 | 156 |
| 2020 | 74 | 182 |
| 2021 | 99 | 155 |
| 2022 | 106 | 154 |
| 2023 | 165 | 151 |
| 2024 | 122 | 144 |
| 2025 | 115 | 132 |
| 2026 | 69 | 110 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Coil component and IC card having the same6 Oct 2026US 12,755,129 B2TDK Corporation
- Electronic component6 Oct 2026US 12,755,893 B2Murata Manufacturing Co., Ltd.
- Manufacturing method of coil component and coil component29 Sep 2026US 12,746,712 B2Sumida Corporation
- Coil component29 Sep 2026US 12,749,612 B2Samsung Electro-Mechanics Co., Ltd.
- Coil component25 Aug 2026US 12,718,979 B2Samsung Electro-Mechanics Co., Ltd.
- Method of manufacturing a coil component1 Oct 2026US 2026/0295668 A1Murata Manufacturing Co., Ltd.
- Electronic component and information reading method1 Oct 2026US 2026/0302018 A1TDK Corporation
- Coil component1 Oct 2026US 2026/0302033 A1TDK Corporation
- Inductor and dc-dc converter1 Oct 2026US 2026/0302950 A1TDK Corporation
- Coil component, and method for manufacturing coil component20 Aug 2026US 2026/0245781 A1Delta Electronics (Japan), Inc.
Most cited
By later US patents
- Magnetic element and method of manufacturing the same114US 6,392,525 B1Matsushita Electric Industrial Co., Ltd. · 2002
- Method of manufacturing a solid inductor83US 5,551,146 AMurata Manufacturing Co., Ltd. · 1996
- Inductor coil and method for making same61US 7,034,645 B2Vishay Dale Electronics, Inc. · 2006
- Method of manufacturing a chip coil55US 4,696,100 AMatsushita Electric Industrial Co., Ltd. · 1987
- Circuit board embedded inductor45US 6,996,892 B1RF Micro Devices, Inc. · 2006