Coil component and IC card having the same
AssigneeTDK Corporation
InventorsShoma Kajikiya, Tomohiro Moriki, Makoto Hiraki, Keisuke Hasegawa, Toshio Tomonari
Life of this patent
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Abstract
Disclosed herein is a coil component that includes a magnetic body having a main surface, a first coil pattern disposed so as to overlap the main surface of the magnetic body, and a first resin layer disposed so as to overlap the main surface of the magnetic body and containing particles and binder resin. The first coil pattern has a first surface facing the main surface of the magnetic body and a second surface positioned on a side opposite to the first surface. The first coil pattern is embedded in the first resin layer such that at least the first and second surfaces of the first coil pattern are covered with the first resin layer.
Claims13
A coil component comprising:
- a magnetic body having a main surface;
- a first coil pattern disposed to overlap the main surface of the magnetic body;
- and
- a first resin layer disposed to overlap the main surface of the magnetic body and containing particles and binder resin,
- wherein the first coil pattern has a first surface facing the main surface of the magnetic body and a second surface positioned on a side opposite to the first surface, and
- wherein the first coil pattern is embedded in the first resin layer such that at least the first and second surfaces of the first coil pattern are covered with the first resin layer,
- wherein the first resin layer has a third surface facing the main surface of the magnetic body and a fourth surface positioned on a side opposite the third surface,
- wherein a distance between the first surface of the first coil pattern and the third surface of the first resin layer is larger than a distance between the second surface of the first coil pattern and the fourth surface of the first resin layer,
- wherein the particles include first and second inorganic filler particles, and
- wherein an average value of a particle diameter distribution of the second inorganic filler particles is larger than an average value of a particle diameter distribution of the first inorganic filler particles.
An IC card comprising a coil component,
- wherein the coil component comprises:
- a magnetic body having a main surface;
- a first coil pattern disposed to overlap the main surface of the magnetic body;
- and
- a first resin layer disposed to overlap the main surface of the magnetic body and containing particles and binder resin,
- wherein the first coil pattern has a first surface facing the main surface of the magnetic body and a second surface positioned on a side opposite to the first surface, and
- wherein the first coil pattern is embedded in the first resin layer such that at least the first and second surfaces of the first coil pattern are covered with the first resin layer,
- wherein the first resin layer has a third surface facing the main surface of the magnetic body and a fourth surface positioned on a side opposite the third surface,
- wherein a distance between the first surface of the first coil pattern and the third surface of the first resin layer is larger than a distance between the second surface of the first coil pattern and the fourth surface of the first resin layer,
- wherein the particles include first and second inorganic filler particles, and
- wherein an average value of a particle diameter distribution of the second inorganic filler particles is larger than an average value of a particle diameter distribution of the first inorganic filler particles.
Dependencies are inferred from the claim text.