H01F 17/03
With ceramic former
Official title: with ceramic former
H01F17/03 (With ceramic former) appears on 12 US grants and 16 published applications in this corpus.
Search patents in H01F- Granted patents
- 12
- Published applications
- 16
- Assignees
- 10
- Inventors
- 43
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 2 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Temperature insensitive inductor23 Sep 2025US 12,424,372 B2LRT Sensors LLC
- Coil and transformer having such a coil10 Oct 2023US 11,783,976 B2Endress + Hauser Flowtec AG
- Common mode choke coil23 May 2023US 11,657,946 B2Murata Manufacturing Co., Ltd.
- Method for manufacturing a winding core29 Jun 2021US 11,050,329 B2Murata Manufacturing Co., Ltd.
- Common mode choke coil11 Jun 2019US 10,319,513 B2Murata Manufacturing Co., Ltd.
- Electronic component11 Jun 2026US 2026/0163544 A1Murata Manufacturing Co., Ltd.
- Ceramic-core inductor component23 Apr 2026US 2026/0112527 A1Knowles (UK) Limited
- Air Core Coil15 May 2025US 2025/0157717 A1Yamaha Corporation
- Coil and transformer having such a coil21 Dec 2023US 2023/0411056 A1Endress + Hauser Flowtec AG
- Temperature insensitive inductor30 Nov 2023US 2023/0386724 A1LRT Sensors LLC
Most cited
By later US patents
- Inductor and production method thereof25US 6,104,272 AMurata Manufacturing Co., Ltd. · 2000
- Microfabricated inductors with through-wafer vias10US 8,826,514 B2Teledyne Scientific & Imaging, LLC · 2014
- Chip electronic part9US 5,973,390 AMurata Manufacturing Co., Ltd. · 1999
- Method for producing an inductor6US 6,560,851 B1Murata Manufacturing Co., Ltd. · 2003
- Sensor assembly, transformers and methods of manufacture6US 7,404,331 B2General Electric Company · 2008