Microfabricated inductors with through-wafer vias

A method for producing an inductor comprising the steps of:

• forming a first plurality of vias in a first substrate;
• filling the first plurality of vias in the first substrate with a first plurality of metal fillings;
• forming a first plurality of trenches within the first substrate;
• forming a first insulating layer within the first plurality of trenches;
• forming a first plurality of metal conductors on top of the first insulating layer within the first plurality of trenches;
• connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral;
• forming a second plurality of vias in a second substrate;
• filling the second plurality of vias in the second substrate with a second plurality of metal fillings;
• forming a second plurality of trenches within the second substrate;
• forming a second insulating layer within the second plurality of trenches;
• forming a second plurality of metal conductors on top of the second insulating layer within the second plurality of trenches;
• connecting pairs of the second plurality of metal fillings together using the second plurality of metal conductors;
• and
• connecting the first plurality of metal fillings to the second plurality of metal fillings to form the spiral.

A method for producing an inductor comprising the steps of:

• providing a first substrate having a first side and a second side opposing the first side of the first substrate;
• forming a first plurality of vias in the first substrate;
• filling the first plurality of vias in the first substrate with a first plurality of metal fillings;
• forming a first plurality of metal conductors on the first side of the first substrate;
• connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors;
• providing a second substrate having a first side and a second side opposing the first side of the second substrate;
• forming a second plurality of vias in the second substrate;
• filling the second plurality of vias in the second substrate with a second plurality of metal fillings;
• forming a second plurality of metal conductors on the first side of the second substrate;
• connecting pairs of the second plurality of metal fillings together using the second plurality of metal conductors;
• bonding the second side of the first substrate with the second side of the second substrate, the bonded second substrate formed with the second plurality of vias that are filled with the second plurality of metal fillings;
• and
• connecting the first plurality of metal fillings to the second plurality of metal fillings to form a spiral.