Chip electronic part
AssigneeMurata Manufacturing Co., Ltd.
InventorsKeishiro Amaya, Kenichi Aoki
Life of this patent
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Abstract
The present invention is a chip electronic part having: a ceramic member; a conductor pattern formed on the surface of the ceramic member; an insulating protective layer formed on the conductor pattern; an external electrode which is formed at least one end face of the ceramic member, electrically connected to the conductor pattern, and composed of an undercoating layer formed by dry plating and at least one plating layer formed by wet plating; and at least one groove formed near an end face of the insulating protective layer so as to limit the formation of the undercoating layer.
Claims6
A chip electronic part comprising:
- a ceramic member;
- a conductor pattern located on the surface of said ceramic member;
- an insulating protective layer located on said conductor pattern;
- an external electrode located on at least one end face of said ceramic member and electrically connected to said conductor pattern, said external electrode comprising an undercoating layer formed by dry plating and at least one plating layer formed by wet plating;
- and
- at least one groove located near an end face of said insulating protective layer delimiting said at least one plating layer.
Dependencies are inferred from the claim text.