H01B 3/442
From aromatic vinyl compounds
Official title: {from aromatic vinyl compounds}
H01B3/442 (From aromatic vinyl compounds) appears on 87 US grants and 119 published applications in this corpus.
Search patents in H01B- Granted patents
- 87
- Published applications
- 119
- Assignees
- 80
- Inventors
- 347
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 4 | 3 |
| 2003 | 2 | 2 |
| 2004 | 2 | 0 |
| 2005 | 1 | 6 |
| 2006 | 1 | 2 |
| 2007 | 3 | 0 |
| 2008 | 0 | 4 |
| 2009 | 1 | 4 |
| 2010 | 3 | 8 |
| 2011 | 2 | 2 |
| 2012 | 1 | 7 |
| 2013 | 2 | 7 |
| 2014 | 3 | 5 |
| 2015 | 6 | 11 |
| 2016 | 10 | 8 |
| 2017 | 6 | 9 |
| 2018 | 9 | 5 |
| 2019 | 5 | 7 |
| 2020 | 3 | 8 |
| 2021 | 5 | 1 |
| 2022 | 6 | 4 |
| 2023 | 2 | 2 |
| 2024 | 1 | 5 |
| 2025 | 1 | 3 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composition and cured product thereof12 May 2026US 12,624,220 B2Denka Company Limited
- Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board10 Jun 2025US 12,325,770 B2Mitsubishi Gas Chemical Company, Inc.
- Dielectric material and dielectric material production method6 Feb 2024US 11,890,799 B2Foshan Eahison Communication Co., Ltd.
- Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board26 Sep 2023US 11,769,607 B2Mitsubishi Gas Chemical Company, Inc.
- Sulfonated block copolymers and uses thereof18 Apr 2023US 11,629,215 B2Kraton Corporation
- Conductive particles, conductive materials using the same8 Oct 2026US 2026/0311908 A1Duk San Neolux Co., Ltd.
- Resin composition and power cable30 Jul 2026US 2026/0221310 A1Sumitomo Electric Industries, Ltd.
- Power cable26 Feb 2026US 2026/0058032 A1NKT HV Cables AB
- Power Cable Comprising an Insulation Layer1 Jan 2026US 2026/0004946 A1NKT HV Cables AB
- Insulating resin composition for electric power cable and electric power cable3 Jul 2025US 2025/0215202 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Nanoporous polymer films for extreme low and interlayer dielectrics41US 6,187,248 B1Air Products and Chemicals, Inc. · 2001
- Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin26US 6,908,960 B2TDK Corporation · 2005
- Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom24US 6,420,476 B1Nof Corporation · 2002
- Electrographic recording material16US 4,167,602 AMonsanto Company · 1979
- Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same13US 6,500,535 B1Nof Corporation · 2002