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US 11,769,607 B2Granted
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKatsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
Life of this patent
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Abstract
A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
Claims13
A resin composition, comprising:
- a maleimide compound,
- a cyanate ester compound, the content of the cyanate ester compound is 0.01 to 40 parts by mass based on 100 parts by mass in total of resins and components that form resins by polymerization in the resin composition,
- a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and
- an inorganic filler,
- wherein the cyanate ester compound comprises a compound represented by the following formula (7):
- wherein:
- each R6 independently represents a hydrogen atom or a methyl group, and
- n2 represents an integer of 1 or larger.
5 more elements
Dependencies are inferred from the claim text.