Conductive particles, conductive materials using the same

Abstract

Provided are conductive particles used in COG and COP technologies of display devices, where the content of gold (Au) is optimized to an appropriate weight range by weight to lower contact resistance, reduce manufacturing costs, and improve stability against heat and moisture, and where the conductive particles is formed with a nickel (Ni) conductive layer and a gold (Au) outer layer on a core particle, thereby improving electrical performance and durability and providing structural stability that can minimize the risk of short circuits and maintain reliability even in fine-pitch environments. The present disclosure is suitable for connection technology of high-precision display devices, such as smartphones and tablet PCs, and can be utilized in next-generation ultra-thin and high-resolution display panels.

Dependencies are inferred from the claim text.