H01B 3/088
Shaping of glass or deposition of glass
Official title: {Shaping of glass or deposition of glass}
H01B3/088 (Shaping of glass or deposition of glass) appears on 13 US grants and 8 published applications in this corpus.
Search patents in H01B- Granted patents
- 13
- Published applications
- 8
- Assignees
- 13
- Inventors
- 42
- Latest grant
- 6 Sep 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 0 | 0 |
| 2022 | 2 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low porosity glass coatings formed on coiled wires, high temperature devices containing the same, and methods for the fabrication thereof6 Sep 2022US 11,437,188 B2Honeywell International Inc.
- Substrate for flexible device16 Aug 2022US 11,414,762 B2Toyo Seikan Group Holdings, Ltd.
- Glass flake paper10 Aug 2004US 6,773,793 B2Electrolock, Inc.
- Dielectric compositions9 Jun 1992US 5,120,579 AFerro Corporation
- Dielectric compositions3 Dec 1991US 5,070,047 AFerro Corporation
- Electrical feedthrough assembly with augmented creepage distance1 Oct 2026US 2026/0302000 A1Schott AG
- Flexible glass element and method for its production3 Sep 2026US 2026/0260777 A1Schott AG
- Nanowire bundle and method for manufacturing same2 Mar 2023US 2023/0064255 A1Samsung Electro-Mechanics Co., Ltd.
- Substrate for flexible device7 May 2020US 2020/0141009 A1Toyo Seikan Group Holdings, Ltd.
- Low porosity glass coatings formed on coiled wires, high temperature devices containing the same, and methods for the fabrication thereof26 Mar 2020US 2020/0098516 A1Honeywell International Inc.
Most cited
By later US patents
- Metal bonding glass-ceramic compositions having improved hardness63US 3,977,857 AWestinghouse Electric Corp. · 1976
- Method for manufacturing thin and flexible ribbon of dielectric material having high dielectric constant24US 4,244,722 A1981
- Glass ceramic dielectric compositions19US 4,820,661 AE. I. Du Pont de Nemours and Company · 1989
- Dielectric inks for multilayer copper circuits19US 4,830,988 AGeneral Electric Company · 1989
- Glass ceramic dielectric compositions17US 4,948,759 AE. I. Du Pont de Nemours and Company · 1990