Substrate for flexible device
AssigneeToyo Seikan Group Holdings, Ltd.
InventorsKouji Nanbu, Toshihiko Miyazaki, Hirohisa Masuda, Hiroshi Shimomura
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Abstract
A substrate for a flexible device which includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer.
Claims8
A substrate for flexible device, including a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in a form of layer on a surface of the nickel plating layer, wherein an oxide film having a roughened surface formed by protrusions of crystal grains is formed on the surface of the nickel plating layer, the oxide film having a thickness in a range of 10 to 1200 nm.
A substrate for flexible device, including a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, a glass layer of electrical insulating bismuth-based glass formed in a form of layer on a surface of the nickel plating layer, and a nickel oxide film having a roughened surface formed by protrusions of crystal grains arranged at an interface between the nickel plating layer and the glass layer, wherein the nickel oxide film has a thickness in a range of 10 to 1200 nm and is formed by firing a surface of the nickel plating layer in an oxygen-containing atmosphere at a temperature of 550° to 1000° C. for 5 to 120 seconds.
Dependencies are inferred from the claim text.