Dielectric compositions
AssigneeFerro Corporation
InventorsRobert D. Gardner, Dineen M. Hopp, Aziz S. Shaikh, Gordon J. Roberts
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AssigneeFerro Corporation
InventorsRobert D. Gardner, Dineen M. Hopp, Aziz S. Shaikh, Gordon J. Roberts
Estimating the term…
This invention relates to a dielectric composition comprising: (a) about 30% to about 100% by weight of a glass composition selected from the group consisting of: (a-1) a bismuth-free, lead-free or low-lead containing glass composition having a glass transition temperature in the range of about 600.degree. C. to about 800.degree. C.; (a-2) a mixture of two bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C.; or (a-3) a mixture of three bismuth-free, lead-free or low-lead containing glass compositions comprising a first glass composition having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C., a second glass composition having a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., and a third glass composition having a glass transition temperature in the range of about 650.degree. C. to about 720.degree. C.; (b) up to about 30% by weight of at least one expansion modifier; and (c) up to about 40% by weight of at least one refractory oxide. This invention also relates to thick-film dielectric pastes and dielectric tapes comprising the foregoing dielectric composition. The invention also relates alumina base substrates having the foregoing dielectric composition bonded to at least one surface thereof, and to a method of bonding the foregoing dielectric composition to alumina base substrates.
A dielectric composition formed by firing a composition comprising:
A dielectric composition formed by firing a composition comprising:
A dielectric composition formed by firing a composition comprising a mixture of three glass compositions, the first of said glass compositions having a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and comprising from about 45% to about 60% by weight SiO.sub.2, from about 2% to about 7% by weight B.sub.2 O.sub.3, from about 14% to about 20% by weight PbO, from about 5% to about 12% by weight Al.sub.2 O.sub.3, up to about 3% by weight MgO, from about 4% to about 12% by weight CaO, up to about 3% by weight K.sub.2 O, and up to about 3% by weight Na.sub.2 O;
A composition which upon firing forms a dielectric composition, said composition comprising:
A dielectric paste composition which comprises an admixture of finely divided solids and an organic binder wherein the finely divided solids are present in an amount ranging from about 60% to about 80% by weight of the total composition with said binder being present in an amount ranging from about 20% to about 40% by weight, wherein the finely divided solids include (i) about 25% to about 75% by weight of a mixture of two glass compositions wherein the first glass has a glass transition temperature in the range of about 585.degree. C. to about 620.degree. C. and the second glass has a glass transition temperature in the range of about 765.degree. C. to about 815.degree. C., (ii) up to about 30% by weight of an expansion modifying component, (iii) up to about 40% by weight of refractory oxide, and wherein the binder includes an organic resinous material and a suitable solvent therefor;
Dependencies are inferred from the claim text.