H01B 13/0036
Details
Official title: {Details}
H01B13/0036 (Details) appears on 489 US grants and 664 published applications in this corpus.
Search patents in H01B- Granted patents
- 489
- Published applications
- 664
- Assignees
- 448
- Inventors
- 1,588
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 2 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 2 | 3 |
| 2010 | 2 | 3 |
| 2011 | 0 | 5 |
| 2012 | 1 | 4 |
| 2013 | 3 | 21 |
| 2014 | 14 | 45 |
| 2015 | 9 | 31 |
| 2016 | 30 | 46 |
| 2017 | 26 | 61 |
| 2018 | 40 | 69 |
| 2019 | 58 | 70 |
| 2020 | 58 | 74 |
| 2021 | 51 | 41 |
| 2022 | 47 | 52 |
| 2023 | 44 | 53 |
| 2024 | 36 | 24 |
| 2025 | 39 | 34 |
| 2026 | 17 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low cost scalable micro coaxial interconnect6 Oct 2026US 12,755,868 B2Raytheon Company
- Strength member assemblies and overhead electrical cables incorporating optical fibers29 Sep 2026US 12,749,596 B2CTC Global Corporation
- Interconnexion film and electronic structure comprising such a film29 Sep 2026US 12,750,952 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Structures with integrated conductors18 Aug 2026US 12,712,095 B2Liquid Wire Inc.
- Thickness direction conductive laminated composite material and manufacturing method therefor16 Jun 2026US 12,658,339 B2Beijing Mega Material Innovation Work (M2Iw) Co., Ltd.
- Lead for an active implantable medical device1 Oct 2026US 2026/0295245 A1Saluda Medical Pty Ltd
- Emi protective sleeve and method of construction thereof24 Sep 2026US 2026/0286579 A1Systems Protection Group US LLC
- Method for forming electrode24 Sep 2026US 2026/0290652 A1Jusung Engineering Co., Ltd.
- Method for preparing an elongate conductor element for a welding process, and machine tool for carrying out the method3 Sep 2026US 2026/0260790 A1TRUMPF Laser- und Systemtechnik GmbH
- Conductive nonwoven fabric, pretreatment method for conductive nonwoven fabric, method for manufacturing conductive nonwoven fabric, method for manufacturing conductive nonwoven fabric tape, and method for manufacturing wire harness3 Sep 2026US 2026/0262206 A1Yazaki Corporation
Most cited
By later US patents
- High density electrode structure54US 10,602,947 B2Biosense Webster (Israel) Ltd. · 2020
- Cermet-containing bushing for an implantable medical device34US 8,755,887 B2Heraeus Precious Metals GmbH & Co. KG · 2014
- Nanostructure network and method of fabricating the same28US 11,217,368 B2Industry-University Cooperation Foundation Hanyang University Erica Campus · 2022
- Method for producing conducting and transparent films from combined graphene and conductive nano filaments21US 8,871,296 B2Nanotek Instruments, Inc. · 2014
- Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor16US 10,176,903 B2Japan Science and Technology Agency · 2019