Low cost scalable micro coaxial interconnect
AssigneeRaytheon Company
InventorsJames M. Elliott, Clint B. Sawyer
Life of this patent
Estimating the term…
Abstract
A method of manufacturing one or more coaxial assemblies includes forming a first panel member and a second panel member by diffusion bonding sheets formed of a metal material, disposing one or more conductive elements between the first panel member and the second panel member at locations corresponding to the one or more coaxial assemblies, bonding the first panel member to the second panel member to form an assembly structure including a plurality of coaxial assemblies, and separating the one or more coaxial assemblies from the assembly structure. The bonding includes disposing a conductive epoxy, a conductive solder, or a layer formed of the conductive epoxy or the conductive solder and between the first panel member and the second panel member.
Claims20
A method of manufacturing one or more coaxial assemblies, the method comprising:
- forming a first panel member by diffusion bonding a first sheet formed of a metal material to a second sheet formed of the metal material;
- forming a second panel member by diffusion bonding a third sheet formed of the metal material to a fourth sheet formed of the metal material;
- disposing one or more conductive elements between the first panel member and the second panel member at locations corresponding to the one or more coaxial assemblies, wherein the one or more conductive elements extend in a longitudinal direction of the one or more coaxial assemblies;
- bonding the first panel member to the second panel member to form an assembly structure comprising a plurality of coaxial assemblies, wherein the bonding comprises disposing a conductive epoxy or a conductive solder between the first panel member and the second panel member;
- and
- separating the one or more coaxial assemblies from the assembly structure.
An assembly comprising:
- a plurality of layers disposed in a stacked arrangement;
- and
- one or more conductive elements disposed between adjacent layers of the plurality of layers, wherein the one or more conductive elements extend in a longitudinal direction of the assembly,
- wherein:
- each layer comprises two or more diffusion bonded metal layers;
- and
- each layer comprises one or more patterns corresponding to the one or more conductive elements and formed using a chemical etching process.
Dependencies are inferred from the claim text.