G05B 2219/37216
Inpect component placement
G05B2219/37216 (Inpect component placement) appears on 5 US grants and 9 published applications in this corpus.
Search patents in G05B- Granted patents
- 5
- Published applications
- 9
- Assignees
- 8
- Inventors
- 22
- Latest grant
- 3 Jan 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 1 | 0 |
By publication year.
Recent patents
- Mounting state informing apparatus and mounting state informing method3 Jan 2023US 11,543,807 B2Tokyo Electron Limited
- Component mounting device12 Oct 2021US 11,147,201 B2Fuji Corporation
- Component transferring apparatus and IC handler7 Jan 2014US 8,622,198 B2Seiko Epson Corporation
- Method for estimating at least one component placement position on a substrate as well as a device for carrying out such a method6 Jan 2009US 7,474,417 B2Assembleon N.V.
- Cutter head adjustment device27 May 2003US 6,568,884 B2Klingelnberg Sohne GmbH
- Process condition sensing apparatus14 Jul 2022US 2022/0223441 A1KLA Corporation
- Mounting state informing apparatus and mounting state informing method16 Apr 2020US 2020/0117175 A1Tokyo Electron Limited
- Component mounting device6 Feb 2020US 2020/0045863 A1Fuji Corporation
- Substrate inspecting apparatus28 Jul 2016US 2016/0216215 A1Koh Young Technology Inc.
- Component transferring apparatus and ic handler9 Feb 2012US 2012/0034052 A1Seiko Epson Corporation
Most cited
By later US patents
- Component transferring apparatus and IC handler8US 8,622,198 B2Seiko Epson Corporation · 2014
- Cutter head adjustment device2US 6,568,884 B2Klingelnberg Sohne GmbH · 2003
- Method for estimating at least one component placement position on a substrate as well as a device for carrying out such a method1US 7,474,417 B2Assembleon N.V. · 2009